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Specifications
Voltage Rating:
35V
Capacitance:
4.7uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
0603X5R475M350NT
Model Number:
0603X5R475M350NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Compliance: RoHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC). | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Testing Conditions | Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code (e.g., 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225) Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (e.g., 8R0, 100, 101 in pF) Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) Rated Voltage (DC) (e.g., 250, 251, 252 in V) Terminal Composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dimension (mm) |
| Digital caliper | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Operating Temperature Range | -55~+125 | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Static Capacity Tolerance | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Rated Voltage (DC) | Examples: 250 (25V), 251 (250V), 252 (2500V) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 for exceptions based on voltage and capacitance. Note 1: Detailed DF exceptions for various rated voltages and capacitance values are provided in the document. | Frequency and voltage specific to characteristic (e.g., 1MHz10% at 1.00.2Vrms for NPO 1000pF; 1KHz10% at 1.00.2Vrms for X7R/X7T/X7P 10uF). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Hi-pot (DC) | Dielectric strength varies based on rated voltage (Ur): Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Solderability | Soldering area 90%, No damage. | Pre-heating: 80-120 (10-30s), Lead-free solder, flux. Soldering temp: 2455, Solder time: 20.5s. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering | No damage, soldering area 90%. | Pre-heating: 100-200 (102s), Soldering temp: 2655 (51s). Cleaning with solvent. Room temp, 242 hours. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Initial capacitance testing: Pre-heating 150 (1 hour), then 48 hours under normal conditions. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Flexural Strength | No damage. Electrostatic capacity change rate C/C10%. | Base board: Al2O3 /PCB (1.6mm thickness). Flexural depth: 1mm. Bend speed: 0.5mm/sec. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Terminal Bonding Strength | No visual damage. | Applied Force: 5N, Duration: 101S. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | 5 cycles of thermal shock. Test after 242 hours at normal temp & humidity. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Moisture Exposure | NPO: C/C2% or 1pF X7R/X7T/X7P: C/C10% DF 2 times initial standard NPO IR: IR2500M or IR*Cr25S X7R/X7T/X7P IR: IR1000M or IR*Cr25S | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours at normal temp & humidity. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| High Temperature Exposure | NPO: C/C2% or 1pF X7R/X7T/X7P: C/C20% DF 2 X initial standard NPO IR: IR4000M or IR*Cr40S X7R/X7T/X7P IR: IR2000M or IR*Cr50S | Temperature: 1253, Time: 100048 hours. Voltage dependent on rated voltage. Test after 48 hours under normal conditions. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCB Flexural Strength | No crack and other defect. | IR Soldering MLCC on PCB, then pressing. Dimensions A, B, C vary by size (e.g., 0805, 1206, 1210, 1812, 2220). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing Options | Embossed Plastic Taping (Tape/Reel), Paper Tape Reel Packing (Bag packing) | Detailed dimensions for tape sizes and reel dimensions provided. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing Quantity | Varies by size and packing type (e.g., Paper T/R: 4000 pcs for 0603; Plastic T/R: 3000 pcs for 1206 T1.35mm). | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering. Specific recommendations based on size, temperature characteristic, rated voltage, and capacitance. | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips T150 during preheating. | Refer to adjacent graph (not included in text). |
Precautions for Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes like burnout, flaming, or glowing, adhere to the following precautions:
- Soldering Profile: Follow recommended temperature profiles to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control. Avoid direct contact of the tip with the ceramic body.
- Optimum Solder Amount: Use recommended solder amounts for reflow soldering.
2509251626_AIDE-CAPACITOR-0603X5R475M350NT_C49326383.pdf
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