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Specifications
Voltage Rating:
50V
Capacitance:
15nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R153K500NT
Model Number:
0603X7R153K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, with options for different tolerances, rated voltages, and terminal compositions.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS Compliance: Meets the standard
- REACH Compliance: Meets the standard
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC) | - |
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | - |
| Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | - |
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (pF) Tolerance of Electrostatic Capacity (e.g., M: 20%) Rated Voltage (DC) (e.g., 251: 250V) Terminal Composition Packing (T: Tape/Reel, P: Bag) | - |
| Dimension Codes (L*W) | 0201: 0.02*0.01 inch / 0.50*0.25 mm | - |
| 0402: 0.04*0.02 inch / 1.00*0.50 mm | - | |
| 0603: 0.06*0.03 inch / 1.60*0.80 mm | - | |
| 0805: 0.08*0.05 inch / 2.00*1.25 mm | - | |
| 1206: 0.12*0.06 inch / 3.20*1.60 mm | - | |
| 1210: 0.12*0.10 inch / 3.20*2.50 mm | - | |
| 1808: 0.18*0.08 inch / 4.50*2.00 mm | - | |
| 1812: 0.18*0.12 inch / 4.50*3.20 mm | - | |
| 1825: 0.18*0.25 inch / 4.50*6.30 mm | - | |
| 2211: 0.22*0.11 inch / 5.70*2.8 mm | - | |
| 2220: 0.22*0.20 inch / 5.70*5.00 mm | - | |
| 2225: 0.22*0.25 inch / 5.70*6.30 mm | - | |
| 0603 (Metric): 1.600.20mm (L) x 0.800.15mm (W) x 0.300.10mm (T) | - | |
| 0805 (Metric): 2.000.20mm (L) x 1.250.20mm (W) x 0.500.20mm (T) | - | |
| 1206 (Metric): 3.200.30mm (L) x 1.600.30mm (W) x 0.600.30mm (T) | - | |
| 1210 (Metric): 3.200.30mm (L) x 2.500.30mm (W) x 0.800.30mm (T) | - | |
| 1808 (Metric): 4.500.40mm (L) x 2.000.20mm (W) x 0.800.30mm (T) | - | |
| 1812 (Metric): 4.500.40mm (L) x 3.200.30mm (W) x 0.800.30mm (T) | - | |
| 1825 (Metric): 4.500.40mm (L) x 6.300.50mm (W) x 0.800.30mm (T) | - | |
| 2220 (Metric): 5.700.50mm (L) x 5.000.50mm (W) x 1.000.40mm (T) | - | |
| 2225 (Metric): 5.700.50mm (L) x 6.300.50mm (W) x 1.000.40mm (T) | - | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | - |
| Temperature Range | -55~+125 | Visual/ Dimension |
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | Meet standard specification and tolerance |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF); IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C25nF) | Rated voltage, 605s, Humidity:75%, Temperature:255, Current:50mA |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux; Soldering temperature 2455, Solder time 20.5s |
| Resistance to heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Refer to NO#3 |
| Flexural Strength | Electro static capacity change rate: C/C10% | Base board: Al2O3 /PCB; PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm; Flexural depth: 1mm; Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity |
| Temperature Moisture Exposure | Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity |
| High Temperature Exposure | Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, Then pressing direction base on the photo. |
| Embossed Plastic Taping (0805~1812) | See Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) | - |
| Paper Tape Reel Packing (1005~1206) | See Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) | - |
| Reel Dimensions | 7' REEL: 1782.0; 13' REEL: 3302.0 | - |
| Top Tape Peeling Strength (Embossed Taping) | 0.1N < peeling strength < 0.7N | Standard |
| Packing Quantity | See Page 11 for details by size and tape type | - |
| Soldering Profile | Follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | - |
| Recommended Soldering Method | RReflow Soldering, WWave Soldering | See Page 13 for details by size, temperature characteristics, rated voltage, and capacitance. |
| Soldering Temperature Profile | Keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | - |
2509251626_AIDE-CAPACITOR-0603X7R153K500NT_C49326617.pdf
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