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Specifications
Voltage Rating:
50V
Capacitance:
680pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R681K500NT
Model Number:
0603X7R681K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS Compliance: Meets the standard
- REACH Compliance: Meets the standard
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | - |
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | - |
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | - |
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature Characteristic Nominal Electrostatic Capacity Tolerance of Electrostatic Capacity Rated Voltage (DC) Terminal Composition Packing | - |
| Dimension Codes | 0201 (0.02*0.01 inch / 0.50*0.25 mm) 0402 (0.04*0.02 inch / 1.00*0.50 mm) 0603 (0.06*0.03 inch / 1.60*0.80 mm) 0805 (0.08*0.05 inch / 2.00*1.25 mm) 1206 (0.12*0.06 inch / 3.20*1.60 mm) 1210 (0.12*0.10 inch / 3.20*2.50 mm) 1808 (0.18*0.08 inch / 4.50*2.00 mm) 1812 (0.18*0.12 inch / 4.50*3.20 mm) 1825 (0.18*0.25 inch / 4.50*6.30 mm) 2211 (0.22*0.11 inch / 5.70*2.8 mm) 2225 (0.22*0.25 inch / 5.70*6.30 mm) | - |
| Temperature Characteristic Codes | C0G (030 PPM/), X7R (15%), X5R (15%) | - |
| Nominal Electrostatic Capacity | 8R0 = 8.0 pF, 100 = 10 pF, 101 = 100 pF | - |
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | - |
| Rated Voltage (DC) | 250 = 25V, 251 = 250V, 252 = 2500V | - |
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | - |
| Dimensions (mm) | 0201: L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 0402: L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 0603: L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10 0805: L 2.000.20, W 1.250.20, T 0.800.20, WB 0.500.20 1206: L 3.200.30, W 1.600.30, T 1.000.20, WB 0.600.30 1210: L 3.200.30, W 2.500.30, T 2.70, WB 0.800.30 1808: L 4.500.40, W 2.000.20, T 2.70, WB 0.800.30 1812: L 4.500.40, W 3.200.30, T 3.50, WB 0.800.30 1825: L 4.500.40, W 6.300.50, T 3.50, WB 0.800.30 2220: L 5.700.50, W 5.000.50, T 3.50, WB 1.000.40 2225: L 5.700.50, W 6.300.50, T 6.20, WB 1.000.40 | Digital calliper |
| Temperature Range | -55~+125 | - |
| Static Capacity Test (NPO) | 1000pF: 1MHz10%, 1.00.2Vrms >1000pF: 1KHz10%, 1.00.2Vrms | - |
| Static Capacity Test (X7R/X7T/X7P) | 10uF: 1KHz10%, 1.00.2Vrms >10uF: 120Hz24, 0.50.1Vrms | - |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | - |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF) X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux; Soldering temperature 2455, Solder time 20.5s |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. |
| Flexural Strength | Electro static capacity change rate: C/C10% | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test under flexural status. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (Lower reading), X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, Time 50024 hours. Test after placing 242 hours normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading), X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. Sizes: 0805(2012), 1206(3216), 1210(3225), 1812(4532), 2220(5750) |
| Embossed Plastic Taping Dimensions | 0805: Tape size 1.550.20, A 2.350.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.10, H 1.50 -0/+0.10, J 1.50 Max 1206: Tape size 1.950.20, A 3.600.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.1, H 1.50 -0/+0.10, J 1.85 Max 1210: Tape size 2.700.10, A 3.420.10, B 8.000.10, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 3.2 Max 1808: Tape size 2.200.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.50 -0/+0.10, J 3.0 Max 1812: Tape size 3.660.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 8.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 4.0 Max | - |
| Paper Tape Reel Packing Dimensions | 1005: Paper size W1 0.240.02, L1 0.450.02, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t 0.30 Below 0201: Paper size W1 0.370.10, L1 0.670.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t 0.80 Below 0402: Paper size W1 0.650.10, L1 1.150.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t 0.80 Below 0603: Paper size A 1.100.10, B 1.900.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max 0805: Paper size A 1.450.15, B 2.300.15, C 8.00.15, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max 1206: Paper size A 1.800.20, B 3.400.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max | - |
| Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | - |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | - |
| Packing Quantity | 0603 Paper T/R: 4000 pcs 0805 Paper T/R: 4000 pcs 0805 Plastic T/R: 3000 pcs (T1.35mm) 1206 Plastic T/R: 3000 pcs (T1.60mm) 1210 Plastic T/R: 2000 pcs (T1.60mm), 3000 pcs (T>1.60mm) 1808 Plastic T/R: 2000 pcs (T1.85mm) 1812 Plastic T/R: 1000 pcs (T1.85mm), 800 pcs (T>1.85mm) 1812 Plastic T/R: 500 pcs | - |
| Soldering Method | RReflow Soldering, WWave Soldering | - |
Precautions for Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can lead to burn out, flaming, or glowing. Follow safety precautions and application notes. For handling questions, contact the engineering section or factory.
Soldering Profile: Avoid cracks due to sudden temperature change. Follow the recommended temperature profile.
Manual Soldering: Risk of thermal cracks. Handle soldering iron carefully, paying attention to tip selection and temperature contact.
Optimum Solder Amount for Reflow Soldering: Recommended amounts provided.
Recommended Soldering Method: Specific methods for different sizes, characteristics, rated voltages, and capacitances are detailed.
Soldering Temperature Profile: During preheating, maintain temperature difference between soldering temperature and chip surface temperature as T150.
2509251626_AIDE-CAPACITOR-0603X7R681K500NT_C49326657.pdf
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