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Specifications
Voltage Rating:
50V
Capacitance:
22nF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G223J500NT
Model Number:
0805C0G223J500NT
Package:
0805
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in power supplies such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They offer reliable performance under specified conditions and are available in various sizes and temperature characteristics.
Product Attributes
- Temperature Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Compliance: ROHS/REACH compliant
Technical Specifications
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Temperature Range | -55~+125 | - |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper |
| Static Capacity | NPO characteristic: Capacity 1000pF @ 1MHz10%, 1.00.2Vrms NPO characteristic: Capacity 1000pF @ 1KHz10%, 1.00.2Vrms | - |
| X7R/X7T/X7P characteristic: Capacity 10uF @ 1KHz10%, 1.00.2Vrms X7R/X7T/X7P characteristic: Capacity 10uF @ 120Hz24, 0.50.1Vrms | - | |
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF NPO Characteristic: DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) NPO Characteristic: DF0.15%, (50pFCr) X7R/X7T/X7P characteristic: See Note 1 | Cr1000pF, 110%MHz, 1V0.2rms Cr1000pF, 110%KHz, 1V0.2rms Cr10uF, 110%KHz, 1V0.1rms Cr10uF, 12024Hz, 0.5V0.1rms |
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF NPO Characteristic: IR*Cr500S, C10nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| X7R/X7T/X7P Characteristic: IR10000M, C25nF X7R/X7T/X7P Characteristic: IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage Ur=200V/250V, 2.0 x rated voltage Ur=450/500/630V, 1.5 x rated voltage 1KVUr2KV, 1.2 x rated voltage 2KVUr, 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux Soldering temperature 2455, Solder time 20.5s |
| Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading) | - |
| X7R: C/C15% | - | |
| X7T: -33% C/C22% X7P: C/C10% | - | |
| Flexural Strength | No damage | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10% |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| X7R/X7P characteristic: C/C0.5% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |
| X7T characteristic: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |
| Temperature Moisture Exposure | Visual: No visual damage | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. |
| Electrostatic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10% | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |
| High Temperature Exposure | Visual: No visual damage | Temperature 1253, Time 100048 hours. Test after place 48 hours under normal pressure & temperature. |
| Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% | Temperature 1253, Time 100048 hours. Test after place 48 hours under normal pressure & temperature. | |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. |
Dimensions & Part Number Description
| Dimension Code | L*W (inch) | L*W (mm) | Part Number Example |
|---|---|---|---|
| 0201 | 0.02*0.01 | 0.50*0.25 | 1812 X7R 684 M 251 N T |
| 0402 | 0.04*0.02 | 1.00*0.50 | - |
| 0603 | 0.06*0.03 | 1.60*0.80 | - |
| 0805 | 0.08*0.05 | 2.00*1.25 | - |
| 1206 | 0.12*0.06 | 3.20*1.60 | - |
| 1210 | 0.12*0.10 | 3.20*2.50 | - |
| 1808 | 0.18*0.08 | 4.50*2.00 | - |
| 1812 | 0.18*0.12 | 4.50*3.20 | - |
| 1825 | 0.18*0.25 | 4.50*6.30 | - |
| 2211 | 0.22*0.11 | 5.70*2.8 | - |
| 2225 | 0.22*0.25 | 5.70*6.30 | - |
| Part Number Item | Description |
|---|---|
| Dimension Code | See Dimension Table |
| Temperature Characteristic | C0G, X7R, X5R |
| Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% |
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V |
| Terminal Composition | Au/Ag-Ni-Sn |
| Packing | T: Tape/Reel, P: Bag packing |
Packing Information
| Packing Type | Size | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) | J (mm) | T (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Embossed Plastic Taping | |||||||||||
| 0805 | T | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | T | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | T | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | T | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | T | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing | |||||||||||
| 1005 | - | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | - | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | - | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0603 | - | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | - | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | - | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | A | B | C | D | E | F | G |
|---|---|---|---|---|---|---|---|
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) |
|---|---|---|---|
| 0603 | T1.35mm | 4000 | 3000 |
| 0805 | - | 4000 | 3000 |
| 1206 | T1.60mm | - | 3000 |
| 1210 | T1.85mm | - | 2000 |
| 1808 | - | - | 1000 |
| 1812 | T1.85mm | - | 1000 |
| 1812 | - | - | 800 |
Precautions For Use
MLCCs may fail in short or open circuit modes when subjected to electrical or mechanical stress beyond specified ratings. To prevent burnout, flaming, or glowing, adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is carefully selected and used, avoiding direct contact with the ceramic body.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| / | C1uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| / | C4.7uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| / | C10uf | R/W | ||
| Y5V | / | C10uf | R | |
| / | C10uf | R/W | ||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.
2509251626_AIDE-CAPACITOR-0805C0G223J500NT_C49326672.pdf
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