Product Overview
The 1206(X7S) Surface Mount Ceramic Capacitor (MLCC) is designed for high-voltage electronic circuits, serving critical functions such as coupling, filtering, and resonance. It is ideal for applications including switching power supplies, AC-DC and DC-DC converters, network/communication interfaces, LCD module backlight power supplies, and energy-saving lamp ballasts.
Product Attributes
- Temperature Characteristic: X7S (22%)
- Termination Material: Copper/Silver-Nickel-Tin (inner to outer)
- Environmental Compliance: RoHS Directive, REACH Regulation
Technical Specifications
| Item | Specification | Test Method | ||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Test Conditions | ||||||||||||||||||||||
| Standard State | Normal Temperature: 15~35 Normal Humidity: 45~75%RH Normal Pressure: 86~106kPa | N/A | ||||||||||||||||||||
| Standard Relative State | Normal Temperature: 252 Normal Humidity: 60~70%RH Normal Pressure: 86~106kPa | N/A | ||||||||||||||||||||
| Product Structure and Dimensions | ||||||||||||||||||||||
| Structure | 1. Ceramic Dielectric 2. Internal Electrode 3. External Electrode 4. Nickel Layer 5. Tin Layer | N/A | ||||||||||||||||||||
| Dimensions (mm) |
| N/A | ||||||||||||||||||||
| Specifications and Test Methods | ||||||||||||||||||||||
| 1. Operating Temperature Range | -55~+125 | N/A | ||||||||||||||||||||
| 2. Appearance and Dimensions | 1. No visible damage 2. Dimensions meet specifications | Visual inspection; Vernier caliper measurement | ||||||||||||||||||||
| 3. Capacitance | Within specified tolerance |
| ||||||||||||||||||||
| 4. Dissipation Factor (DF Value) | See detailed specifications in the original document (Note 1) | See detailed methods in the original document | ||||||||||||||||||||
| 5. Insulation Resistance (IR) | See detailed specifications in the original document | DC Test Voltage: 500V (for rated voltage 500V) or rated voltage (for rated voltage <500V); Test time: 605s; Humidity: 75%; Temperature: 255 | ||||||||||||||||||||
| 6. Dielectric Strength (DC) | No dielectric breakdown or damage. Test voltage is 1.1 to 2.5 times rated voltage based on voltage rating. | Voltage application time: 1-10s; Holding time: 2s | ||||||||||||||||||||
| 7. Solderability | Tinning rate >90%; No visible damage | Preheat: 80-120 for 10-30s; Solder temperature: 2455; Soldering time: 20.5s | ||||||||||||||||||||
| 8. Resistance to Soldering Heat | No visible damage; Tinning rate 90% | Preheat: 100-200 for 102s; Immersion temperature: 2605; Immersion time: 51s; Post-immersion: 242 hours at room temperature. Capacitance change rate: See detailed specs. DF value: See NO4. IR: See NO5. | ||||||||||||||||||||
| 9. Bending Strength | No visible damage; Capacitance change rate: 10% | Test substrate: Al2O3 or PCB (1.6mm thickness, 100mm length, 40mm width); Bending depth: 1mm; Pressing speed: 0.5mm/sec. Measurement under bent state. | ||||||||||||||||||||
| 10. Terminal Tensile Strength | No visible damage | N/A | ||||||||||||||||||||
| 11. Temperature Cycling | Capacitance change rate: See detailed specs for NPO, X7R/X5R, X6S. | 5 cycles of temperature exposure (low temp, room temp, high temp). Post-conditioning: 242 hours at room temp/humidity. | ||||||||||||||||||||
| 12. Humidity Resistance | Appearance: No visible damage; Capacitance change rate: See detailed specs for NPO, X7R/X6S/X5R; DF value: 2 times initial standard; IR: See detailed specs for NPO, X7R/X6S/X5R. | Temperature: 402; Humidity: 90~95%RH; Time: 50024 hours. Post-conditioning: 24 hours at room temp/humidity. | ||||||||||||||||||||
| 13. High-Temperature Load Test | Appearance: No visible damage; Capacitance change rate: See detailed specs for NPO, X7R/X6S/X5R; DF value: 2 times initial standard; IR: See detailed specs for NPO, X7R/X6S/X5R. | Temperature: 853; Time: 100048 hours. Voltage: 1.2 to 2 times rated voltage based on voltage rating. Charge/discharge current: 50mA. Post-conditioning: 484 hours at room temp/humidity. | ||||||||||||||||||||
| 14. Board Flex Resistance | No cracks or defects | Capacitors soldered onto a fixture, then subjected to force. Soldering via reflow. | ||||||||||||||||||||
| Packaging Information | ||||||||||||||||||||||
| Packaging Type | T: Tape & Reel; P: Bulk (PE Bag) | N/A | ||||||||||||||||||||
| Tape & Reel Dimensions | See detailed dimensions for plastic reel and paper tape packaging in the original document. | N/A | ||||||||||||||||||||
| Packaging Quantity | See detailed quantities for paper tape and tape & reel packaging by size in the original document. | N/A | ||||||||||||||||||||
2507091655_AIDE-CAPACITOR-1206X7S475K500NT_C49326794.pdf
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