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Specifications
Voltage Rating:
6.3V
Capacitance:
100uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
1210X5R107M6R3NT
Model Number:
1210X5R107M6R3NT
Package:
1210
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer various temperature characteristics (C0G, X7R, X5R) and are available in a wide range of dimensions and electrical specifications.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Application Field | High voltage circuits | |
| Function | Coupling, wave filtering, resonant | |
| Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |
| Type | Medium and High voltage MLCC | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Packing Options | Tape/Reel (T), Bag packing (P) | |
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Initial Capacitance Testing Pre-heating | 150 for 1 hour, then 48 hours under normal pressure & temperature | |
| Construction | Ceramic dielectric | N/A |
| Inner electrode | N/A | |
| Outer electrode | N/A | |
| Plating | Nickel layer, Tin layer | |
| Operating Temperature | NPO Characteristic | -55~+125 |
| X7R/X7T/X7P Characteristic | N/A (Refer to specific test conditions) | |
| Dimensions (mm) | 0201 (0603) | L: 0.600.10, W: 0.300.05, T: 0.300.05, WB: 0.100.05 |
| 0402 (1005) | L: 1.000.15, W: 0.500.15, T: 0.500.10, WB: 0.200.10 | |
| 0603 (1608) | L: 1.600.20, W: 0.800.15, T: 0.800.15, WB: 0.300.10 | |
| 0805 (2012) | L: 2.000.20, W: 1.250.20, T: 0.800.20, WB: 0.500.20 | |
| 1206 (3216) | L: 3.200.30, W: 1.600.30, T: 1.000.20, WB: 0.600.30 | |
| 1210 (3225) | L: 3.200.30, W: 2.500.30, T: 2.70, WB: 0.800.30 | |
| 1808 (4520) | L: 4.500.40, W: 2.000.20, T: 2.70, WB: 0.800.30 | |
| 1812 (4532) | L: 4.500.40, W: 3.200.30, T: 3.50, WB: 0.800.30 | |
| 1825 (4563) | L: 4.500.40, W: 6.300.50, T: 3.50, WB: 0.800.30 | |
| 2220 (5750) | L: 5.700.50, W: 5.000.50, T: 3.50, WB: 1.000.40 | |
| 2225 (5763) | L: 5.700.50, W: 6.300.50, T: 6.20, WB: 1.000.40 | |
| Static Capacity | Nominal Capacity | 8R0=8.0pF, 100=10pF, 101=100pF |
| Tolerance | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | Code | 250=25V, 251=250V, 252=2500V |
| Hi-pot Test (DC) | 100V: 2.5 x rated voltage; 200V/250V: 2.0 x rated voltage; 450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage | |
| High Temperature Exposure Voltage | 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage | |
| Dissipation Factor (DF) | NPO Characteristic | DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) |
| X7R/X7T/X7P Characteristic | Refer to Note 1 table for specific values based on voltage and capacitance. | |
| Insulation Resistance (IR) | NPO Characteristic | IR50000M, C10nF; IR*Cr500S, C10nF |
| X7R/X7T/X7P Characteristic | IR10000M, C25nF; IR*Cr100S, C25nF | |
| Solderability | Soldering area90% | Pre-heating: 80-120 (10-30s); Solder: 2455 (20.5s) |
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating: 100-200 (102s); Solder: 2655 (51s) |
| Electrostatic Capacity Change Rate | NPO Characteristic | C/C0.5% or 0.5pF (larger reading) |
| X7R Characteristic | C/C15% | |
| X7T Characteristic | -33% C/C22% | |
| X7P Characteristic | C/C10% | |
| Flexural Strength | No damage | Test under flexural status (Depth: 1mm, Speed: 0.5mm/sec) |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N (Duration: 101S) |
| Thermal Shock | NPO Characteristic | C/C2.5% or 0.25pF (larger reading) |
| X7R/X7P Characteristic | C/C0.5% | |
| X7T Characteristic | C/C10% | |
| Temperature Moisture Exposure | Capacitance Change Rate | NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10% |
| IR | NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | |
| High Temperature Exposure | Capacitance Change Rate | NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20% |
| IR | NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | |
| PCB Flexural Strength | No crack and other defect | IR measurement after soldering MLCC on PCB and applying pressure |
| Embossed Plastic Taping Dimensions (mm) | 0805 | Tape Size: 1.550.20, A: 2.350.20, B: 8.000.20, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.10, G: 4.000.10, H: 1.50 -0/+0.10, J: 1.50 Max |
| 1206 | Tape Size: 1.950.20, A: 3.600.20, B: 8.000.20, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.10, G: 4.000.1, H: 1.50 -0/+0.10, J: 1.85 Max | |
| 1210 | Tape Size: 2.700.10, A: 3.420.10, B: 8.000.10, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.05, G: 4.000.10, H: 1.55 -0/+0.10, J: 3.2 Max | |
| 1808 | Tape Size: 2.200.10, A: 4.950.10, B: 12.000.10, C: 5.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.05, G: 4.000.10, H: 1.50 -0/+0.10, J: 3.0 Max | |
| 1812 | Tape Size: 3.660.10, A: 4.950.10, B: 12.000.10, C: 5.500.05, D: 1.750.10, E: 8.000.10, F: 2.000.05, G: 4.000.10, H: 1.55 -0/+0.10, J: 4.0 Max | |
| Paper Tape Reel Packing Dimensions (mm) | 1005 | W1: 0.240.02, L1: 0.450.02, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.30 Below |
| 0201 | W1: 0.370.10, L1: 0.670.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below | |
| 0402 | W1: 0.650.10, L1: 1.150.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below | |
| 0603 | A: 1.100.10, B: 1.900.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | |
| 0805 | A: 1.450.15, B: 2.300.15, C: 8.00.15, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | |
| 1206 | A: 1.800.20, B: 3.400.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | |
| Reel Dimensions (mm) | 7REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max |
| 13REEL | 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Top Tape Peeling Strength | Paper Taping | 0.1N < peeling strength < 0.7N |
| Packing Quantity | 0603 | Paper T/R: 4000 Pcs |
| 0805 | Paper T/R: 4000 Pcs, Plastic T/R: 3000 Pcs | |
| 1206 | Paper T/R: 4000 Pcs, Plastic T/R: 3000 Pcs (T1.35mm), 3000 Pcs (T1.35mm) | |
| 1210 | Plastic T/R: 2000 Pcs (T1.60mm), 3000 Pcs (T1.60mm) | |
| 1808 | Plastic T/R: 2000 Pcs | |
| 1812 | Plastic T/R: 1000 Pcs (T1.85mm), 1000 Pcs (T1.85mm) | |
| 1812 Above | Plastic T/R: 800 Pcs | |
| 2220 | Plastic T/R: 500 Pcs | |
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent burnout, flaming, or glowing, adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron, tip selection, and contact temperature.
- Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.
- Recommended Soldering Method: RReflow Soldering, WWave Soldering. Specific recommendations vary by size, temperature characteristic, rated voltage, and capacitance.
- Soldering Temperature Profile: During preheating, maintain a temperature difference of T150 between soldering temperature and chip surface temperature.
2509251626_AIDE-CAPACITOR-1210X5R107M6R3NT_C49326798.pdf
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