Product Overview
High-reliability Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding applications in medium and high-voltage circuits. These capacitors are crucial for coupling, wave filtering, and resonant functions within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer robust performance and are manufactured to meet stringent industry standards.
Product Attributes
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out).
- Compliance: RoHS and REACH compliant.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power supplies, energy saving lamps. | ||
| Medium and High voltage MLCC | |||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | |||
| Dimension Code | Inch/mm | 0201 (0.02*0.01 / 0.50*0.25), 0402 (0.04*0.02 / 1.00*0.50), 0603 (0.06*0.03 / 1.60*0.80), 0805 (0.08*0.05 / 2.00*1.25), 1206 (0.12*0.06 / 3.20*1.60), 1210 (0.12*0.10 / 3.20*2.50), 1808 (0.18*0.08 / 4.50*2.00), 1812 (0.18*0.12 / 4.50*3.20), 1825 (0.18*0.25 / 4.50*6.30), 2211 (0.22*0.11 / 5.70*2.8), 2225 (0.22*0.25 / 5.70*6.30) | N/A |
| Temperature Characteristic | Code | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A |
| Nominal Electrostatic Capacity | Code | 8R0 (8.0pF), 100 (10pF), 101 (100pF) | N/A |
| Tolerance of Electrostatic Capacity | Code | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | N/A |
| Rated Voltage (DC) | Code | 250 (25V), 251 (250V), 252 (2500V) | N/A |
| Packing | Code | T (Tape/Reel), P (Bag packing) | N/A |
| Construction & Dimension | Construction Items | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | N/A |
| Dimensions (mm) | Part Number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 0.800.20 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 0.800.20 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 0.800.30 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 0.800.30 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 1.000.40 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 1.000.40 | N/A | |
| Temperature Characteristic | -55~+125 | N/A | |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static Capacity | Meet standard specification and tolerance | NPO: 1000pF (1MHz10%, 1.00.2Vrms); >1000pF (1KHz10%, 1.00.2Vrms) X7R/X7T/X7P: 10uF (1KHz10%, 1.00.2Vrms); >10uF (120Hz24, 0.50.1Vrms) | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: Cr1000pF (110%MHz, 1V0.2rms); Cr1000pF (110%KHz, 1V0.2rms) X7R/X7T/X7P: Cr10uF (110%KHz, 1V0.1rms); Cr10uF (12024Hz, 0.5V0.1rms) | |
| IR Insulation Resistance | NPO: IR50000M (C10nF); IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | |
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate: C/C10%. | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |
| Temperature Moisture Exposure | Visual: No visual damage. Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |
| High Temperature Exposure | Visual: No visual damage. Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | |
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6. | |
| Embossed Plastic Taping | Embossed tape reel packing for 0805(2012)~1812(4532) type | Code | Tapesize A | B | C | D | E | F | G | H | J T | 0805 | 1.550.20 | 2.350.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1206 | 1.950.20 | 3.600.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1210 | 2.700.10 | 3.420.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 1808 | 2.200.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 1812 | 3.660.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 8.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | N/A |
| Paper tape reel packing for 10050402~12063216 | Code | Papersize W1 | L1 | D | C | B | P1 | P2 | P0 | d | t 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below Code | Papersize A | B | C | D | E | F | G | H | J | t 0603 | 1.100.10 | 1.900.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 0805 | 1.450.15 | 2.300.15 | 8.00.15 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 1206 | 1.800.20 | 3.400.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | N/A | |
| Reel Dimensions | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | N/A | |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | Standard | |
| Packing Quantity | Paper T/R (Pcs): 0603 (4000), 0805 (4000), 1206 (4000) Plastic T/R (Pcs): 0805 (3000), 1206 (3000 T1.35mm), 1210 (2000 T1.60mm), 1808 (3000 T1.60mm), 1812 (2000) | N/A | |
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering | Refer to Page 13 for detailed recommendations based on size, characteristics, rated voltage, and capacitance. | |
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips as T150. | Refer to Page 14. | |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burnout, flaming, or glowing in the worst case. Adhere to the following precautions for safety and application notes. Consult engineering or the factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper handling of the soldering iron tip and temperature.
- Optimum Solder Amount for Reflow Soldering: Use recommended solder amounts.
- Recommended Soldering Methods: Refer to the provided tables for specific recommendations.
2509251626_AIDE-CAPACITOR-1210X5R476M160NT_C49326806.pdf
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