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Specifications
Voltage Rating:
2kV
Capacitance:
10nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1210X7R103K202NT
Model Number:
1210X7R103K202NT
Package:
1210
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings and are constructed with ceramic dielectric, inner and outer electrodes, a nickel layer, and a tin layer.
Product Attributes
- Material: Ceramic dielectric, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits such as switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||
| Testing Conditions: Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||
| Part Number Description | Item | Description | Example | ||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | 1812 | |||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | X7R | |||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | 684 (68000pF = 68nF) | |||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | M (20%) | |||
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | 251 (250V) | |||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | N (Not specified in example, but implied by data) | |||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | T | |||
| Construction and Dimension | Construction: | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickle layer 5. Tin layer | N/A | ||
| Dimension (mm) | Part number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification and Testing Method | Temperature | -55~+125 | N/A | ||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||
| Static Capacity | NPO: 1000pF 1MHz10% 1.00.2Vrms; >1000pF 1KHz10% 1.00.2Vrms X7R/X7T/X7P: 10uF 1KHz10% 1.00.2Vrms; >10uF 120Hz24 0.50.1Vrms | N/A | |||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 1MHz10%, 1V0.2rms. Cr1000pF, 1KHz10%, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24Hz, 0.5V0.1rms. (See Note 1 for exceptions) | N/A | |||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | N/A | |||
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | N/A | |||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455. Solder time 20.5s. | |||
| Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | N/A | |||
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | |||
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature. | |||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, Then pressing direction base on the photo. | |||
| Embossed Plastic Taping | Dimensions for 0805 to 1812 types | See Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) | |||
| Paper Tape Reel Packing | Dimensions for 1005, 0201, 0402, 0603, 0805, 1206 types | See Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t or A, B, C, D, E, F, G, H, J, T) | |||
| Reel Dimensions | 7REEL, 13REEL | See Page 10 for detailed dimensions (A, B, C, D, E, F, G) | |||
| Taping Specification | Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N | |||
| Packing Quantity | Paper T/R (Pcs), Plastic T/R (Pcs) | See Page 11 for detailed quantities per size. | |||
| Soldering Method | RReflow Soldering, WWave Soldering | See Page 13 for recommended methods by size, temperature characteristics, rated voltage, and capacitance. | |||
| Soldering Temperature Profile | See Page 14 for temperature profile guidelines. Preheating temperature difference T150. | ||||
Note 1: X7R/X5R/X6S/X7S/Y5V Rated voltage DF Exception of D.F. values are detailed on Page 4 and 5.
Precautions For Use: Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe conditions beyond specified ratings. Follow precautions for safety and application notes. Refer to soldering profiles and manual soldering guidelines to avoid thermal cracks. Ensure optimum solder amount and recommended soldering methods.
2509251626_AIDE-CAPACITOR-1210X7R103K202NT_C49326808.pdf
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