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Specifications
Voltage Rating:
100V
Capacitance:
2.2uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1210X7R225K101NT
Model Number:
1210X7R225K101NT
Package:
1210
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer various temperature characteristics (C0G, X7R, X5R) and a wide range of capacitance, tolerance, and voltage ratings. They are constructed with ceramic dielectric, inner and outer electrodes, and nickel/tin layers, available in multiple standard sizes and packing options.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1. Application Field | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 2. Testing Conditions | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3. Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Item 1: Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Item 2: Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Item 3: Nominal Electrostatic Capacity | 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Item 4: Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Item 5: Rated Voltage (DC) | 250 = 25V, 251 = 250V, 252 = 2500V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Item 6: Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Item 7: Packing | T: Tape/Reel, P: Bag packing (PE) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 4. Construction and Dimension | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dimension (mm) |
| Digital caliper | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5. Specification and Testing Method | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature | -55~+125 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Static Capacity | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms. X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dissipation Factor (DF) | NPO: DF0.56% (Cr5 pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). Cr1000pF @ 1MHz10%, 1V0.2rms. Cr1000pF @ 1KHz10%, 1V0.2rms. X7R/X7T/X7P: Cr10uF @ 1KHz10%, 1V0.1rms. Cr10uF @ 120Hz24, 0.5V0.1rms. (See Note 1 for exceptions) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF). X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF). Testing condition: Rated voltage, 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | Initial capacitance testing: Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Flexural Strength | No damage. Electro static capacity change rate: C/C10%. | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Terminal Bonding Strength | No visual damage. | Applied Force: 5N, Duration: 101S. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Moisture Exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| High Temperature Exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCB Flexural Strength | No crack and other defect. | Soldering the MLCC on the PCB, then pressing direction based on the photo. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing Quantity |
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| Soldering Method | RReflow Soldering, WWave Soldering | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2509251626_AIDE-CAPACITOR-1210X7R225K101NT_C49326820.pdf
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