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Specifications
Voltage Rating:
100V
Capacitance:
100nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R104K101NT
Model Number:
0805X7R104K101NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in different temperature characteristics (C0G, X7R, X5R) and a wide range of dimensions and electrical specifications to meet diverse industrial needs.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS/REACH compliance
Technical Specifications
| Item | Description | Details | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC). | ||||||||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing | ||||||||||
| Dimension Codes (L*W) | Inch | Metric (mm) | |||||||||
| 0201 | 0.02*0.01 | 0.50*0.25 | |||||||||
| 0402 | 0.04*0.02 | 1.00*0.50 | |||||||||
| 0603 | 0.06*0.03 | 1.60*0.80 | |||||||||
| 0805 | 0.08*0.05 | 2.00*1.25 | |||||||||
| 1206 | 0.12*0.06 | 3.20*1.60 | |||||||||
| 1210 | 0.12*0.10 | 3.20*2.50 | |||||||||
| 1808 | 0.18*0.08 | 4.50*2.00 | |||||||||
| 1812 | 0.18*0.12 | 4.50*3.20 | |||||||||
| 1825 | 0.18*0.25 | 4.50*6.30 | |||||||||
| 2211 | 0.22*0.11 | 5.70*2.8 | |||||||||
| 2225 | 0.22*0.25 | 5.70*6.30 | |||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||||
| Nominal Electrostatic Capacity | Examples: 8R0=8.0pF, 100=10pF, 101=100pF | ||||||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||||
| Rated Voltage (DC) | Examples: 250=25V, 251=250V, 252=2500V | ||||||||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||||||||
| Packing | T: Tape/Reel, P: Bag packing (PE) | ||||||||||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | ||||||||||
| Dimensions (mm) | Part Number (British/Metric) | L Tol | W Tol | T Tol | WB Tol | ||||||
| 0201 (0603) | 0.60 0.10 | 0.30 0.05 | 0.30 0.05 | 0.10 0.05 | |||||||
| 0402 (1005) | 1.00 0.15 | 0.50 0.15 | 0.50 0.10 | 0.20 0.10 | |||||||
| 0603 (1608) | 1.60 0.20 | 0.80 0.15 | 0.80 0.15 | 0.30 0.10 | |||||||
| 0805 (2012) | 2.00 0.20 | 1.25 0.20 | 0.80 0.20 | 0.50 0.20 | |||||||
| 1206 (3216) | 3.20 0.30 | 1.60 0.30 | 1.00 0.20 | 0.60 0.30 | |||||||
| 1210 (3225) | 3.20 0.30 | 2.50 0.30 | 2.70 | 0.80 0.30 | |||||||
| 1808 (4520) | 4.50 0.40 | 2.00 0.20 | 2.70 | 0.80 0.30 | |||||||
| 1812 (4532) | 4.50 0.40 | 3.20 0.30 | 3.50 | 0.80 0.30 | |||||||
| 1825 (4563) | 4.50 0.40 | 6.30 0.50 | 3.50 | 0.80 0.30 | |||||||
| 2220 (5750) | 5.70 0.50 | 5.00 0.50 | 3.50 | 1.00 0.40 | |||||||
| 2225 (5763) | 5.70 0.50 | 6.30 0.50 | 6.20 | 1.00 0.40 | |||||||
| Temperature Range | -55~+125 | ||||||||||
| Solderability | Soldering area 90%, Visual-No damage. Pre-heating: 80-120 (10-30s), Lead-free solder, flux. Soldering temp: 2455, Time: 20.5s. | ||||||||||
| Resistance to Heat of Soldering | Visual-No damage, soldering area 90%. Pre-heating: 100-200 (102s), Soldering temp: 2655 (51s). Cleaning with solvent. Room temp, 242 hours. | ||||||||||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%. | ||||||||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. Pre-condition (X7R h): Upper limit temp 1hr, 241 hrs, 5 cycles. Test after 242 hrs normal temp & humidity. | ||||||||||
| Temperature Moisture Exposure | Visual: No visual damage. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | ||||||||||
| High Temperature Exposure | Visual: No visual damage. Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | ||||||||||
| PCB Flexural Strength | No crack and other defect. IR test after soldering MLCC on PCB. | ||||||||||
| Embossed Plastic Taping Dimensions (mm) | Code | Tape Size (A) | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | |
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper Size (W1) | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (mm) | Unit | A | B | C | D | E | F | G | |||
| 7' REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| 13' REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||||
| Packing Quantity (Pcs) | Size | Paper T/R | Plastic T/R | ||||||||
| 0603 | 4000 | - | |||||||||
| 0805 | 4000 | 3000 (T1.35mm) | |||||||||
| 1206 | - | 3000 (T>1.35mm) | |||||||||
| 1210 | - | 2000 (T1.60mm) | |||||||||
| 1808 | - | 3000 (T>1.60mm) | |||||||||
| 1812 | - | 2000 | |||||||||
| 1812 | - | 1000 (T1.85mm) | |||||||||
| 2220 | - | 800 | |||||||||
| 2225 | - | 500 | |||||||||
| Precautions for Use | MLCCs may fail in short circuit mode under severe conditions. Follow precautions for safety and application notes. Avoid sudden temperature changes during soldering. Manual soldering requires care to prevent thermal cracks. Use optimum solder amount for reflow soldering. | ||||||||||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering. Specific methods vary by size, temperature characteristic, rated voltage, and capacitance. | ||||||||||
| Soldering Temperature Profile | Preheating temperature difference between soldering temperature and surface temperature of chips: T150. | ||||||||||
2509251626_AIDE-CAPACITOR-0805X7R104K101NT_C48579599.pdf
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