Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | N/A |
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A |
| Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A |
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | N/A |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | N/A |
| Packing | T (Tape/Reel), P (Bag packing) | N/A |
| Dimension Code (Inch / mm) | 0201 (0.02*0.01 / 0.50*0.25) | N/A |
| 0402 (0.04*0.02 / 1.00*0.50) | N/A | |
| 0603 (0.06*0.03 / 1.60*0.80) | N/A | |
| 0805 (0.08*0.05 / 2.00*1.25) | N/A | |
| 1206 (0.12*0.06 / 3.20*1.60) | N/A | |
| 1210 (0.12*0.10 / 3.20*2.50) | N/A | |
| 1808 (0.18*0.08 / 4.50*2.00) | N/A | |
| 1812 (0.18*0.12 / 4.50*3.20) | N/A | |
| 1825 (0.18*0.25 / 4.50*6.30) | N/A | |
| 2211 (0.22*0.11 / 5.70*2.8) | N/A | |
| 2225 (0.22*0.25 / 5.70*6.30) | N/A | |
| Temperature Range | -55~+125 | Naked eye (Visual inspection), Digital calliper |
| Static Capacity (NPO) | 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms | N/A |
| Static Capacity (X7R/X7T/X7P) | 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | N/A |
| Dissipation Factor (DF) NPO | DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10 (5pFCr50pF); DF0.15% (50pFCr) | Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms |
| Dissipation Factor (DF) X7R/X7T/X7P | See Note 1 | Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms |
| Insulation Resistance (IR) NPO | IR50000M (C10nF); IR*Cr500S (C10nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Insulation Resistance (IR) X7R/X7T/X7P | IR10000M (C25nF); IR*Cr100S (C25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate (after heat/humidity/flexing) | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | N/A |
| Flexural Strength | No damage; Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage; Electrostatic capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage; Electrostatic capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction base on the photo. |
| Embossed Plastic Taping Dimensions (mm) | 0805: A=1.550.20, B=2.350.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.50 Max | N/A |
| Paper Tape Reel Packing Dimensions (mm) | 1005: W1=0.240.02, L1=0.450.02, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.30 Below | N/A |
| Reel Dimensions (mm) | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | N/A |
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | N/A |
| Packing Quantity (Pcs) | 0603 Paper T/R: 4000; 0805 Plastic T/R: 3000; 1210 Plastic T/R (T1.60mm): 3000; 1812 Plastic T/R (T1.85mm): 1000 | N/A |
| Soldering Method | RReflow Soldering, WWave Soldering | N/A |
2509251626_AIDE-CAPACITOR-0805X7R105K350NT_C48579603.pdf
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