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Specifications
Voltage Rating:
50V
Capacitance:
22nF
Temperature Coefficient:
X7R
Tolerance:
±5%
Mfr. Part #:
0603X7R223J500NT
Model Number:
0603X7R223J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits | ||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | ||
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |
| 6. Terminal Composition | Au/Ag-Ni-Sn | |
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | |
| Construction and Dimension | ||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimension (mm) | Part Number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 0.800.30 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 0.800.30 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 0.800.30 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 0.800.30 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 1.000.40 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 1.000.40 | |
| Specification and Testing Method | ||
| Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 110%MHz, 1V0.2rms (Cr1000pF); 110%KHz, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 110%KHz, 1V0.1rms (Cr10uF); 12024Hz, 0.5V0.1rms (Cr10uF) |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating: 80-120, 10-30s; Solder: Lead free, Flux; Soldering temp: 2455, Time: 20.5s |
| Resistance to the heat of soldering | No damage, Soldering area 90% | Pre-heating: 100-200, 102s; Soldering temp: 2655, Time: 51s. Cleaning with solvent. Room temp, 242 hours. |
| Electrostatic Capacity Change Rate | NPO: |C/C| 0.5% or 0.5pF; X7R: |C/C| 15%; X7T: -33% C/C22%; X7P: |C/C| 10% | Pre-heating 150 1 hour, then 48 hours under normal conditions. |
| Flexural Strength | No damage; Electro static capacity change rate |C/C| 10% | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: |C/C| 2.5% or 0.25pF; X7R/X7P: |C/C| 0.5%; X7T: |C/C| 10% | 5 cycles. Test after 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage; Capacity Change Rate: NPO: |C/C| 2% or 1pF, X7R/X7T/X7P: |C/C| 10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S, X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage; Capacity Change Rate: NPO: |C/C| 2% or 1pF, X7R/X7T/X7P: |C/C| 20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S, X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | Soldering MLCC on PCB, then pressing. Sizes: 0805(2012) to 2220(5750) with specific dimensions A, B, C. |
| Embossed Plastic Taping Dimensions (mm) | ||
| Code | Tape size A, B, C, D, E, F, G, H, J, T | |
| 0805 | 1.550.20, 2.350.20, 8.000.20, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10, 1.50 Max | |
| 1206 | 1.950.20, 3.600.20, 8.000.20, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.1, 1.50 -0/+0.10, 1.85 Max | |
| 1210 | 2.700.10, 3.420.10, 8.000.10, 3.500.05, 1.750.10, 4.000.10, 2.000.05, 4.000.10, 1.55 -0/+0.10, 3.2 Max | |
| 1808 | 2.200.10, 4.950.10, 12.000.10, 5.500.05, 1.750.10, 4.000.10, 2.000.05, 4.000.10, 1.50 -0/+0.10, 3.0 Max | |
| 1812 | 3.660.10, 4.950.10, 12.000.10, 5.500.05, 1.750.10, 8.000.10, 2.000.05, 4.000.10, 1.55 -0/+0.10, 4.0 Max | |
| Paper Tape Reel Packing Dimensions (mm) | ||
| Code | Paper size W1, L1, D, C, B, P1, P2, P0, d, t | |
| 1005 | 0.240.02, 0.450.02, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10, 0.30 Below | |
| 0201 | 0.370.10, 0.670.10, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10, 0.80 Below | |
| 0402 | 0.650.10, 1.150.10, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10, 0.80 Below | |
| 0603 | 1.100.10, 1.900.10, 8.000.10, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10, 1.10 Max | |
| 0805 | 1.450.15, 2.300.15, 8.00.15, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10, 1.10 Max | |
| 1206 | 1.800.20, 3.400.20, 8.000.20, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10, 1.10 Max | |
| Reel Dimensions (mm) | ||
| Unit | A, B, C, D, E, F, G | |
| 7' REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| 13' REEL | 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Taping Specification | ||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | Paper Taping, Embossed Taping |
| Packing Quantity (Pcs) | ||
| Size | Paper T/R | Plastic T/R |
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm), 3000 (T1.35mm) |
| 1206 | - | 2000 (T1.60mm), 3000 (T1.60mm) |
| 1210 | - | 2000 |
| 1808 | - | 1000 (T1.85mm) |
| 1812 | - | 1000 (T1.85mm) |
| 1812 above | - | 800 |
| (Other sizes may vary) | 500 | |
| Recommended Soldering Method | ||
| Size | Temperature Characteristics | Soldering Method |
| 1005 | NPO, X7R/X5R/X7S/X6S | R |
| 0201 | NPO, X7R/X5R/X7S/X6S, Y5V | R |
| 0402 | NPO, X7R/X5R/X7S/X6S, Y5V | R |
| 0603 | NPO, X7R/X5R/X7S/X6S (C1uf), Y5V (C1uf) | R/W |
| 0805 | NPO, X7R/X5R/X7S/X6S (C4.7uf), Y5V (C1uf) | R/W |
| 1206 | NPO, X7R/X5R/X7S/X6S (C10uf), Y5V (C10uf) | R/W |
| 1210 | NPO, X7R/X5R/X7S/X6S, Y5V | R |
| Soldering method | RReflow Soldering, WWave Soldering | |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can result in burnout, flaming, or glowing. Adhere to the following precautions and application notes.
- Soldering Profile: Follow the provided temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron tip and temperature.
- Refer to adjacent graphs and enclosure pages for detailed soldering profiles and recommendations.
2509251626_AIDE-CAPACITOR-0603X7R223J500NT_C49326626.pdf
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