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Specifications
Voltage Rating:
50V
Capacitance:
39nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R393K500NT
Model Number:
0603X7R393K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets standards
Technical Specifications
| Item | Specification/Requirement | Testing Method | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T (Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dimension Codes (L*W in inch / mm) | 0201 (0.02*0.01 / 0.50*0.25), 0402 (0.04*0.02 / 1.00*0.50), 0603 (0.06*0.03 / 1.60*0.80), 0805 (0.08*0.05 / 2.00*1.25), 1206 (0.12*0.06 / 3.20*1.60), 1210 (0.12*0.10 / 3.20*2.50), 1808 (0.18*0.08 / 4.50*2.00), 1812 (0.18*0.12 / 4.50*3.20), 1825 (0.18*0.25 / 4.50*6.30), 2211 (0.22*0.11 / 5.70*2.8), 2225 (0.22*0.25 / 5.70*6.30) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Characteristic Codes | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Nominal Electrostatic Capacity (pF) | 8R0 (8.0), 100 (10), 101 (100) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing Codes | T (Tape/Reel), P (Bag packing) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dimensions (mm) |
| N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Range | -55~+125 | Naked eye (Visual inspection), Digital calliper | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Static Capacity | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms. X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms. | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 110%MHz, 1V0.2rms. Cr1000pF, 110%KHz, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. (See Note 1 for exceptions) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. Testing: Rated voltage, 605s, Humidity:75%, Temp:255, Current:50mA. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5x rated voltage; Ur=200V/250V, 2.0x rated voltage; Ur=450/500/630V, 1.5x rated voltage; 1KVUr2KV, 1.2x rated voltage; 2KVUr, 1.1x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Solderability | Soldering area90%. Visual-No damage. | Pre-heating: 80-120, 10-30s; Solder: Lead free, flux; Temp: 2455, Time: 20.5s. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. | Pre-heating: 100-200, 102 s; Soldering Temp: 2655, Time: 51s. Cleaning with solvent. Room temp, 242 hours. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Flexural Strength | No damage. Electro static capacity change rate C/C10%. | Base board: Al2O3 /PCB; PCB dim: Thickness: 1.6mm, Length: 100mm, Width: 40mm; Flexural depth: 1mm; Bend speed: 0.5mm/sec. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Terminal Bonding Strength | No visual damage. | Applied Force: 5N, Duration: 101S. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. | Pre-condition (X7R h): Upper limit temp 1hr, place 241 hrs, start testing. Run 5 cycles. Test after 242hrs normal temp & humidity. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Moisture Exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242hrs normal temp & humidity. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| High Temperature Exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Charging/discharging current 50mA Max. Test after 48hrs normal pressure & temperature. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCB Flexural Strength | No crack and other defect. | Soldering the MLCC on the PCB, then pressing. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Embossed Plastic Taping Dimensions (mm) |
| N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Paper Tape Reel Packing Dimensions (mm) |
| N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Paper Tape Reel Packing Dimensions (mm) |
| N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Reel Dimensions (mm) | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing Quantity |
| N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering. (See Page 13 for specific size and characteristic recommendations) | N/A |
Precautions for Use:
Multi-layer Ceramic Capacitors (MLCC) may fail short or open circuit under severe electrical or mechanical stress beyond specified ratings. This can lead to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact the engineering section or factory for handling questions.
Soldering Profile: Follow the temperature profile in the adjacent graph to avoid thermal cracks due to sudden temperature changes.
Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron, paying attention to tip selection and temperature contact.
Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.
Soldering Temperature Profile: During preheating, keep the temperature difference between soldering temperature and chip surface temperature T 150.
2509251626_AIDE-CAPACITOR-0603X7R393K500NT_C49326644.pdf
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