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Specifications
Voltage Rating:
100V
Capacitance:
2.2nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R222K101NT
Model Number:
1206X7R222K101NT
Package:
1206
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving critical roles in coupling, wave filtering, and resonance within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer a wide range of capacitance, voltage ratings, and temperature characteristics, ensuring reliable performance across various demanding electronic systems. Constructed with ceramic dielectric, inner and outer electrodes, and nickel/tin layers, these MLCCs are available in multiple sizes and packaging options for diverse manufacturing needs.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Details | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, energy-saving lamps. (Medium and High voltage MLCC) | ||||||||||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (pF) Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) Rated Voltage (DC) (V) Terminal Composition Packing (T: Tape/Reel, P: Bag) | ||||||||||||
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickle layer 5. Tin layer | ||||||||||||
| Dimensions (mm) | Part Number | L | W | T | WB | ||||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||||||
| Specification & Testing Method | Item | Specification/Requirement | Testing Method | ||||||||||
| 1. Temperature | -55~+125 | ||||||||||||
| 2. Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||||||||||
| 3. Static Capacity | Meet standard specification and tolerance | See detailed specification in source | |||||||||||
| 4. Dissipation Factor (DF) | See detailed specification in source | See detailed specification in source | |||||||||||
| 5. IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||||||||||
| 6. Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S | |||||||||||
| 7. Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||||||||||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||||
| 9. Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | ||||||||||||
| 10. Flexural Strength | Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | |||||||||||
| 11. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||||||
| 12. Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |||||||||||
| 13. Temperature Moisture Exposure | Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10% DF 2 times initial standard IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | |||||||||||
| 14. High Temperature Exposure | Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20% DF 2 X initial standard IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature 1253, Time 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. | |||||||||||
| 15. PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, Then pressing direction base on the photo. See table for SIZE A, B, C values per MLCC size. | |||||||||||
| Embossed Plastic Taping | Code | Tape size (mm) | A | B | C | D | E | F | G | H | J | T | |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |||
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |||
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |||
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | |||
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | |||
| Paper Tape Reel Packing | Code | Paper size (mm) | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t | |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |||
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |||
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |||
| Code | Paper size (mm) | A | B | C | D | E | F | G | H | J | T | ||
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |||
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |||
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |||
| Reel Dimensions (mm) | Unit: mm | A | B | C | D | E | F | G | |||||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||||
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||||||
| Packing Quantity | Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||||
| 0603 | 4000 | - | |||||||||||
| 0805 | 4000 | 3000 (T1.35mm) | |||||||||||
| 1206 | - | 3000 (T1.60mm) / 2000 (T>1.60mm) | |||||||||||
| 1210 | - | 1000 (T1.85mm) / 800 (T>1.85mm) | |||||||||||
| 1812 | - | 500 | |||||||||||
| Precautions For Use | MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. This can lead to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering for handling questions. | ||||||||||||
| 1. Soldering Profile | Follow the provided temperature profile graph to avoid cracks due to sudden temperature changes. | ||||||||||||
| 2. Manual Soldering | Manual soldering poses a risk of thermal cracks. Handle soldering irons carefully, paying attention to tip selection and temperature contact. | ||||||||||||
| 3. Optimum Solder Amount for Reflow Soldering | |||||||||||||
| 4. Recommended Soldering amounts | |||||||||||||
| Recommended Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | ||||||||
| 1005 | NPO | / | / | R | |||||||||
| X7R/X5R/X7S/X6S | / | / | R | ||||||||||
| 0201 | NPO | / | / | R | |||||||||
| X7R/X5R/X7S/X6S | / | / | R | ||||||||||
| Y5V | / | / | R | ||||||||||
| 0402 | NPO | / | / | R | |||||||||
| X7R/X5R/X7S/X6S | / | / | R | ||||||||||
| Y5V | / | / | R | ||||||||||
| 0603 | NPO | / | / | R/W | |||||||||
| X7R/X5R/X7S/X6S | / | C1uf | R | ||||||||||
| C1uf | R/W | ||||||||||||
| Y5V | / | C1uf | R | ||||||||||
| C1uf | R/W | ||||||||||||
| 0805 | NPO | / | / | R/W | |||||||||
| X7R/X5R/X7S/X6S | / | C4.7uf | R | ||||||||||
| C4.7uf | R/W | ||||||||||||
| Y5V | / | C1uf | R | ||||||||||
| C1uf | R/W | ||||||||||||
| 1206 | NPO | / | / | R/W | |||||||||
| X7R/X5R/X7S/X6S | / | C10uf | R | ||||||||||
| C10uf | R/W | ||||||||||||
| Y5V | / | C10uf | R | ||||||||||
| C10uf | R/W | ||||||||||||
| 1210 | NPO | / | / | R | |||||||||
| X7R/X5R/X7S/X6S | / | / | R | ||||||||||
| Y5V | / | / | R | ||||||||||
| Soldering Method | RReflow Soldering, WWave Soldering | ||||||||||||
| Soldering Temperature Profile | Preheating: Keep temperature difference between soldering temperature and surface temperature of chips T150. | ||||||||||||
2509251626_AIDE-CAPACITOR-1206X7R222K101NT_C49326771.pdf
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