Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonance in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS/REACH compliance
Technical Specifications
| Item | Description | Details |
|---|---|---|
| Application Field | High voltage circuits | |
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. | ||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Initial Testing Condition | Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature. | |
| Part Number Description | 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm) to 2225 (0.22*0.25 inch / 5.70*6.30 mm) |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T (Tape/Reel), P (Bag packing) | |
| Construction | 1. Ceramic dielectric | - |
| 2. Inner electrode | - | |
| 3. Outer electrode | - | |
| 4. Nickle layer | - | |
| 5. Tin layer | - | |
| Dimension (mm) | See detailed table in source document (e.g., 0201: L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05) | |
| Specification & Testing Method | Temperature Range | -55~+125 |
| Visual/Dimension | No Damage, Dimension meet Spec. Tested by naked eye and digital caliper. | |
| Static Capacity | Meets standard specification and tolerance. Testing frequency and voltage vary by characteristic (NPO, X7R/X7T/X7P). | |
| Dissipation Factor (DF) | Specifications vary by characteristic and capacity. (e.g., NPO: DF0.56 for Cr5pF, X7R/X7T/X7P: See Note 1 for exceptions). | |
| Insulation Resistance (IR) | Specifications vary by characteristic and capacity. (e.g., NPO: IR50000M for C10nF, X7R/X7T/X7P: IR10000M for C25nF). Tested at rated voltage for 605s. | |
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage is a multiple of rated voltage (e.g., 2.5 x rated voltage for Ur=100V). | |
| Solderability | Soldering area 90%. Tested with pre-heating, lead-free solder, and flux. | |
| Resistance to the heat of soldering | No damage, soldering area 90%. Tested with pre-heating, soldering, cleaning, and room temperature stabilization. | |
| Electrostatic Capacity Change Rate | Varies by characteristic (NPO: 0.5%, X7R: 15%, X7T: -33% to 22%, X7P: 10%). | |
| Flexural Strength | No damage. Tested on a base board with specified dimensions and flexural depth. Electrostatic capacity change rate 10%. | |
| Terminal Bonding Strength | No visual damage. Tested with applied force of 5N for 101S. | |
| Thermal Shock | Capacity change rate varies by characteristic (NPO: 2.5% or 0.25pF, X7R/X7P: 0.5%, X7T: 10%). Tested over 5 cycles. | |
| Temperature Moisture Exposure | No visual damage. Capacity change rate varies by characteristic (NPO: 2% or 1pF, X7R/X7T/X7P: 10%). DF and IR also specified. Tested for 50024 hours at 402, 90~95%RH. | |
| High Temperature Exposure | No visual damage. Capacity change rate varies by characteristic (NPO: 2% or 1pF, X7R/X7T/X7P: 20%). DF and IR also specified. Tested for 100048 hours at 1253 with specified voltages. | |
| PCB Flexural Strength | No crack and other defects. Tested by soldering MLCC on PCB and applying pressure. | |
| Taping & Packing | Embossed Plastic Taping | Details for 0805 to 1812 types (e.g., Tape size, A, B, C dimensions). |
| Paper Tape Reel Packing | Details for 1005, 0201, 0402, 0603, 0805, 1206 types (e.g., Paper size, W1, L1, D dimensions). | |
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0) | - |
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains. | - |
| Packing Quantity | Varies by size and taping type (e.g., 0603 Paper T/R: 4000 pcs, 0805 Plastic T/R: 3000 pcs). | - |
| Soldering Method | RReflow Soldering, WWave Soldering. Recommended methods vary by size, characteristic, and capacitance. | - |
| Soldering Temperature Profile | Preheating temperature difference T150. | - |
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. This can lead to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact the engineering section or factory for handling questions. Follow recommended soldering profiles to avoid thermal cracks, especially during manual soldering. Ensure optimum solder amount and recommended soldering methods.
2509251626_AIDE-CAPACITOR-1210C0G103J631NT_C49326795.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible