Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications, including coupling, wave filtering, and resonant functions. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Compliance: ROHS/REACH
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| 3. Nominal Electrostatic Capacity | 8R0 (8.0pF), 100 (10pF), 101 (100pF) | ||
| 4. Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | ||
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | ||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||
| 7. Packing | T (Tape/Reel), P (Bag packing) | ||
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimension (mm) | British system | Metric system | |
| 0201 | 0603 | 0.600.10 L, 0.300.05 W, 0.300.05 T, 0.100.05 WB | |
| 0402 | 1005 | 1.000.15 L, 0.500.15 W, 0.500.10 T, 0.200.10 WB | |
| 0603 | 1608 | 1.600.20 L, 0.800.15 W, 0.800.15 T, 0.300.10 WB, 0.600.10 | |
| 0805 | 2012 | 2.000.20 L, 1.250.20 W, 0.800.20 T, 1.000.20 WB, 0.500.20, 1.250.20, 0.800.20 | |
| 1206 | 3216 | 3.200.30 L, 1.600.30 W, 1.000.20 T, 1.250.20 WB, 0.600.30, 1.600.30 | |
| 1210 | 3225 | 3.200.30 L, 2.500.30 W, 2.70 T, 0.800.30 WB | |
| 1808 | 4520 | 4.500.40 L, 2.000.20 W, 2.70 T, 0.800.30 WB | |
| 1812 | 4532 | 4.500.40 L, 3.200.30 W, 3.50 T, 0.800.30 WB | |
| 1825 | 4563 | 4.500.40 L, 6.300.50 W, 3.50 T, 0.800.30 WB | |
| 2220 | 5750 | 5.700.50 L, 5.000.50 W, 3.50 T, 1.000.40 WB | |
| 2225 | 5763 | 5.700.50 L, 6.300.50 W, 6.20 T, 1.000.40 WB | |
| Specification and Testing Method | 1. Temperature | -55~+125 | |
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec. (Visual inspection, Digital caliper) | ||
| 3. Static Capacity | Meet standard specification and tolerance (NPO/X7R/X7T/X7P characteristics) | ||
| 4. Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). X7R/X7T/X7P characteristic: see Note 1. | ||
| 5. IR Insulation Resistance | NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF. X7R/X7T/X7P Characteristic: IR10000M,C25nF; IR*Cr100S,C25nF. (Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA) | ||
| 6. Hi-pot (DC) | No dielectric breakdown or damage. (Voltage depends on rated voltage Ur) | ||
| 7. Solderability | Soldering area90%, Visual-No damage. (Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s) | ||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area90%. (Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.) | ||
| 9. Flexural Strength | No damage. Electro static capacity change rate C/C10%. (Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec.) | ||
| 10. Terminal Bonding Strength | No visual damage. (Applied Force: 5N, Duration: 101S) | ||
| 11. Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10%. (5 cycles) | ||
| 12. Temperature Moisture Exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. (Temperature 402, Humidity 90~95%RH, time 50024 hours) | ||
| 13. High Temperature Exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. (Temperature 1253, Time 100048 hours, Voltage depends on rated voltage) | ||
| 14. PCB Flexural Strength | No crack and other defect. (IR) | ||
| Embossed Plastic Taping | Embossed tape reel packing | For 0805(2012) to 1812(4532) type. (Dimensions provided for tape size, A, B, C, D, E, F, G, H, J, T) | |
| Taping specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | ||
| Paper Tape Reel Packing | For 1005 (0402), 0201, 0402 types | Dimensions provided for paper size W1, L1, D, C, B, P1, P2, P0, d, t. | |
| For 0603, 0805, 1206 types | Dimensions provided for paper size A, B, C, D, E, F, G, H, J, T. | ||
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0) | (Dimensions A, B, C, D, E, F, G provided) | |
| Packing Quantity | Paper T/R (Pcs): 4000 (0603, 0805), 2000 (1206). Plastic T/R (Pcs): 3000 (0805, 1206, 1210), 2000 (1808, 1812), 1000 (1812 and above), 800, 500. | ||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering. (Specific recommendations based on size, temperature characteristics, rated voltage, and capacitance) | ||
| Soldering Temperature Profile | Keep the temperature difference between soldering temperature and surface temperature of chips as T150. | ||
2509251626_AIDE-CAPACITOR-1210X5R226K350NT_C49326801.pdf
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