Product Overview
This Multi-Layer Ceramic Capacitor (MLCC) is designed for high-voltage applications, including coupling, wave filtering, and resonant functions. It is suitable for use in switch power suppliers, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, energy-saving lamps, and other medium to high voltage circuits. The MLCCs are manufactured with ceramic dielectric, inner and outer electrodes, and a nickel/tin layer for termination.
Product Attributes
- Material: Ceramic dielectric, Nickel layer, Tin layer
- Certifications: RoHS/REACH compliant
Technical Specifications
| Item | Description | Details | |||
|---|---|---|---|---|---|
| Application Field | High voltage circuits, including coupling, wave filtering, resonant functions. | ||||
| Applications: Switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| 3. Nominal Electrostatic Capacity | e.g., 8R0=8.0pF, 100=10pF, 101=100pF | ||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| 5. Rated Voltage (DC) | e.g., 250=25V, 251=250V, 252=2500V | ||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| 7. Packing | T (Tape/Reel), P (Bag packing) | ||||
| Construction | 1. Ceramic dielectric | N/A | |||
| 2. Inner electrode | N/A | ||||
| 3. Outer electrode | N/A | ||||
| 4. Nickle layer | N/A | ||||
| 5. Tin layer | N/A | ||||
| Dimension (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification and Testing Method | 1. Temperature | -55~+125 | |||
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | ||||
| 3. Static Capacity | Meets standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | ||||
| 4. Dissipation Factor (DF) | NPO and X7R/X7T/X7P characteristics specified | ||||
| 5. IR Insulation Resistance | NPO and X7R/X7T/X7P characteristics specified | ||||
| 6. Hi-pot (DC) | Based on rated voltage (Ur) | ||||
| 7. Solderability | Soldering area 90%, Visual-No damage | ||||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area 90% | ||||
| 9. Flexural Strength | No damage, Electrostatic capacity change rate 10% | ||||
| 10. Terminal Bonding Strength | No visual damage, Applied Force: 5N | ||||
| 11. Thermal Shock | NPO, X7R/X7P, X7T characteristics specified | ||||
| 12. Temperature Moisture Exposure | Visual-No damage, Capacitance change rate, DF, IR specified | ||||
| 13. High Temperature Exposure | Visual-No damage, Capacitance change rate, DF, IR specified | ||||
| 14. PCB Flexural Strength | No crack and other defect | ||||
| Packing | Embossed Plastic Taping | For 0805(2012) to 1812(4532) types | |||
| Paper Tape Reel Packing | For 1005(0402) to 1206(3216) types | ||||
| Structure of leader/end part | Specified for carrier paper | ||||
| Reel Dimensions | 7REEL | 1782.0 | |||
| 13REEL | 3302.0 | ||||
| Taping Specification | Top tape peeling strength | 0.1N < peeling strength < 0.7N | |||
| Packing Quantity | Paper T/R (Pcs) | e.g., 0603: 4000 pcs | |||
| Plastic T/R (Pcs) | e.g., 0805: 3000 pcs | ||||
| ROHS/REACH Compliance | Meet the standard | ||||
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent issues like burn out, flaming, or glowing, adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron tip and temperature.
- Optimum Solder Amount for Reflow Soldering: Recommended amounts are provided.
- Recommended Soldering Method: Specific methods (R-Reflow, W-Wave) are recommended based on size, characteristics, rated voltage, and capacitance.
- Soldering Temperature Profile: Maintain temperature differences during preheating.
2509251626_AIDE-CAPACITOR-1206X5R106M250NT_C49326741.pdf
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