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Specifications
Voltage Rating:
16V
Capacitance:
22uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R226K160NT
Model Number:
1206X7R226K160NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is ideal for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in different temperature characteristics (C0G, X7R, X5R) and a wide range of dimensions and electrical specifications to meet diverse industrial needs.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS/REACH compliance
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, such as switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||
| Testing Conditions: Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (pF) Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) Rated Voltage (DC) (V) Terminal Composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag) | ||||
| Dimension Codes & Sizes | Inch/mm (L*W): 0201 (0.02*0.01 / 0.50*0.25), 0402 (0.04*0.02 / 1.00*0.50), 0603 (0.06*0.03 / 1.60*0.80), 0805 (0.08*0.05 / 2.00*1.25), 1206 (0.12*0.06 / 3.20*1.60), 1210 (0.12*0.10 / 3.20*2.50), 1808 (0.18*0.08 / 4.50*2.00), 1812 (0.18*0.12 / 4.50*3.20), 1825 (0.18*0.25 / 4.50*6.30), 2211 (0.22*0.11 / 5.70*2.8), 2225 (0.22*0.25 / 5.70*6.30) | ||||
| Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Temperature Range | -55~+125 | ||||
| Static Capacity | Meets standard specification and tolerance. NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF). | ||||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). Testing frequency 110%MHz, voltage 1V0.2rms (Cr1000pF); 110%KHz, voltage 1V0.2rms (Cr>1000pF). X7R/X7T/X7P: See Note 1. | ||||
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF). Testing condition: Rated voltage, 605s, Humidity75%, Temperature: 255, Current 50mA. X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF). | ||||
| Hi-pot (DC) | No dielectric breakdown or damage. Voltage application based on rated voltage (Ur): 100V (2.5x Ur), 200V/250V (2.0x Ur), 450/500/630V (1.5x Ur), 1KVUr2KV (1.2x Ur), 2KVUr (1.1x Ur). Voltage Raising time: 110S, Maintaining time: 2S. | ||||
| Solderability | Soldering area90%, No damage. Pre-heating: 80-120 (10-30s). Soldering: 2455 (20.5s). | ||||
| Resistance to the heat of soldering | No damage, soldering area90%. Pre-heating: 100-200 (102s). Soldering: 2655 (51s). Cleaning. Room temperature, 242 hours. | ||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF. X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | ||||
| Flexural Strength | No damage. Electrostatic capacity change rate C/C10%. Flexural depth 452 mm. | ||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. 5 cycles. | ||||
| Temperature Moisture Exposure | Visual: No damage. Capacity Change Rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | ||||
| High Temperature Exposure | Visual: No damage. Capacity Change Rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | ||||
| PCB Flexural Strength | No crack and other defect. IR measurement. | ||||
| Embossed Plastic Taping | Details provided for tape sizes (0805 to 1812) including dimensions A, B, C, D, E, F, G, H, J, T. | ||||
| Paper Tape Reel Packing | Details provided for tape sizes (1005, 0201, 0402, 0603, 0805, 1206) including dimensions W1, L1, D, C, B, P1, P2, P0, d, t. | ||||
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0). | ||||
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. | ||||
| Packing Quantity | Paper T/R (Pcs): 4000 (0603, 0805), 3000 (1206). Plastic T/R (Pcs): 3000 (0805, 1206, 1210), 2000 (1808, 1812), 1000 (1812+), 800 (2220), 500 (2225). | ||||
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering. Specific recommendations provided based on size, temperature characteristic, rated voltage, and capacitance. | ||||
2509251626_AIDE-CAPACITOR-1206X7R226K160NT_C49326779.pdf
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