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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X5R225M500NT for High Voltage Circuits Applications factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X5R225M500NT for High Voltage Circuits Applications factory
>
Specifications
Voltage Rating:
50V
Capacitance:
2.2uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
0603X5R225M500NT
Model Number:
0603X5R225M500NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
  • Compliance: RoHS/REACH

Technical Specifications

Item Description/Specification
Application Field
Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. (Medium and High voltage MLCC)
Testing Conditions
Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
Nominal Electrostatic Capacity 8R0=8.0pF, 100=10pF, 101=100pF
Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
Rated Voltage (DC) 250=25V, 251=250V, 252=2500V
Packing T: Tape/Reel, P: Bag packing (PE)
Construction
Item Description
1 Ceramic dielectric
2 Inner electrode
3 Outer electrode
4 Nickle layer
5 Tin layer
Dimension (mm)
Part number L (mm) W (mm) T (mm) WB (mm)
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method
Temperature -55~+125
Visual/Dimension 1. No Damage 2. Dimension meet Spec
Static Capacity NPO: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms
X7R/X7T/X7P: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms
Dissipation Factor (DF) NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10 (5pFCr50pF), DF0.15% (50pFCr). Testing frequency: 110%MHz (Cr1000pF), 110%KHz (Cr1000pF). Testing voltage: 1V0.2rms.
X7R/X7T/X7P: Cr10uF, Test frequency 110%KHz, Voltage 1V0.1rms. Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms. (See Note 1 for exceptions)
IR Insulation Resistance NPO: IR50000M (C10nF), IR*Cr500S (C10nF). Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA.
X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF).
Hi-pot (DC) No dielectric breakdown or damage. Test voltage based on rated voltage (Ur): 100V: 2.5xUr; 200V/250V: 2.0xUr; 450/500/630V: 1.5xUr; 1KVUr2KV: 1.2xUr; 2KVUr: 1.1xUr. Voltage Raising time: 110S, Voltage maintaining time: 2S.
Solderability Soldering area90%. Visual-No damage. Pre-heating: 80-120, 10-30s. Solder: lead free, flux. Soldering temperature: 2455. Solder time: 20.5s.
Resistance to the heat of soldering Visual-No damage, soldering area90%. Pre-heating: 100-200, 102s. Soldering temperature: 2655. Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic Capacity Change Rate NPO: C/C0.5% or 0.5pF (larger reading).
X7R: C/C15%.
X7T: -33% C/C22%.
X7P: C/C10%.
Flexural Strength No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%.
Terminal Bonding Strength No visual damage. Applied Force: 5N. Duration: 101S.
Thermal Shock NPO: C/C2.5% or 0.25pF (larger reading).
X7R/X7P: C/C0.5%.
X7T: C/C10%. Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after 242 hours normal temp & humidity.
Temperature Moisture Exposure Visual: No visual damage. Test after 242 hours normal temp & humidity. Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours.
Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%.
DF: 2 times initial standard.
IR: NPO: IR2500M or IR*Cr25S (lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (lower reading).
High Temperature Exposure Visual: No visual damage. Test after 48 hours under normal pressure & temperature. Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage.
Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%.
DF: 2 X initial standard.
IR: NPO: IR4000M or IR*Cr40S (lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (lower reading).
PCB Flexural Strength No crack and other defect. IR. Soldering the MLCC on the PCB, then pressing direction based on the photo.
Embossed Plastic Taping Dimensions (mm)
Code Tape size A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max
Paper Tape Reel Packing Dimensions (mm)
Code Paper size W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
Reel Dimensions (mm)
Type A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
Taping Specification
Top tape peeling strength 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity (Pcs)
Dimension Paper T/R Plastic T/R
0603 4000 -
0805 4000 3000 (T1.35mm)
1206 - 3000 (T1.60mm) / 2000 (T1.60mm)
1210 - 1000 (T1.85mm) / 800 (T1.85mm)
1808 - 500
1812 - 500
Precautions For Use
Soldering Profile Refer to the graph in the enclosure page (adjacent graph).
Manual Soldering Handle soldering iron carefully, pay attention to tip selection and temperature contact to avoid thermal cracks.
Recommended Soldering Method
Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
/ C1uf R/W
Y5V / C1uf R
/ C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
/ C4.7uf R/W
Y5V / C1uf R
/ C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
/ C10uf R/W
Y5V / C10uf R
/ C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-0603X5R225M500NT_C49326374.pdf

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