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Specifications
Voltage Rating:
6.3V
Capacitance:
10uF
Temperature Coefficient:
X7R
Tolerance:
±20%
Mfr. Part #:
0603X7R106M6R3NT
Model Number:
0603X7R106M6R3NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings, offering reliable performance in demanding electrical environments.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||
| Testing Conditions | |||||
| Normal Condition | Temperature: 15~35 Humidity: 45~75%RH Normal atmosphere: 86~106kPa | (No special requirements) | |||
| Relative Condition | Temperature: 252 Humidity: 60~70%RH Atmosphere: 86~106kPa | For data not matching testing specification | |||
| Part Number Description | Example: 1812 X7R 684 M 251 N T | ||||
| Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | ||||
| Packing | T Tape/Reel, P Bag packing (PE) | ||||
| Construction | 1. Ceramic dielectric | ||||
| 2. Inner electrode | |||||
| 3. Outer electrode | |||||
| 4. Nickle layer | |||||
| 5. Tin layer | |||||
| Dimension (mm) | Part number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Range | -55~+125 | Naked eye (Visual inspection), Digital calliper | |||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | ||||
| Static Capacity | Meet standard specification and tolerance | ||||
| NPO characteristic | 1000pF: 1MHz10%, 1.00.2Vrms >1000pF: 1KHz10%, 1.00.2Vrms | ||||
| X7R/X7T/X7P characteristic | 10uF: 1KHz10%, 1.00.2Vrms >10uF: 120Hz24, 0.50.1Vrms | ||||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF, 110%MHz, 1V0.2rms Cr1000pF, 110%KHz, 1V0.2rms X7R/X7T/X7P characteristic: see Note 1 Cr10uF, 110%KHz, 1V0.1rms Cr10uF, 12024Hz, 0.5V0.1rms | ||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF IR*Cr500S, C10nF Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA X7R/X7T/X7P Characteristic: IR10000M, C25nF IR*Cr100S, C25nF | ||||
| Hi-pot (DC) | No dielectric breakdown or damage Ur=100V,...2.5 x rated voltage Ur=200V/250V,...2.0 x rated voltage Ur=450/500/630V,1.5 x rated voltage 1KVUr2KV,.......1.2 x rated voltage 2KVUr,...............1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||
| Solderability | soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux Soldering temperature 2455 Solder time 20.5s | Visual-No damage | |||
| Resistance to the heat of soldering | Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual-No damage, soldering area90% | |||
| Electrostatic Capacity Change Rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | ||||
| Flexural Strength | Base board: Al2O3 /PCB PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm Flexural depth: 1mm, Bend speed: 0.5mm/sec. Electro static capacity change rate C/C10% | Visual, No damage | |||
| Terminal Bonding Strength | Applied Force: 5N, Duration: 101S | No visual damage | |||
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P- characteristic: C/C0.5% X7T characteristic: C/C10% Pre-condition(X7R h characteristic):Upper limit temperature 1 hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity | ||||
| Temperature Moisture Exposure | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours Electrostatic capacitance change rate NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10% DF 2 times initial standard IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Visual, No visual damage | |||
| High Temperature Exposure | Temperature: 1253, Time: 100048 hours Charging and discharging current: 50mA Max. Voltage: 100VV250V: 2x Rated voltage 250VV1KV: 1.5x rated voltage 1KVV: 1.2x rated voltage Electrostatic capacitance change rate NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% DF 2 X initial standard IR NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Visual, No visual damage | |||
| PCB Flexural Strength | SIZE A B C 0805(2012) 1.2 4 1.65 1206(3216) 2.2 5 2 1210(3225) 2.2 5 2.9 1812(4532) 3.5 7 3.7 2220(5750) 4.5 8 5.6 | No crack and other defect | |||
| Embossed Plastic Taping | 0805: Tapesize 1.550.20, A 2.350.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.10, H 1.50 -0/+0.10, J 1.50 Max 1206: Tapesize 1.950.20, A 3.600.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.1, H 1.50 -0/+0.10, J 1.85 Max 1210: Tapesize 2.700.10, A 3.420.10, B 8.000.10, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 3.2 Max 1808: Tapesize 2.200.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.50 -0/+0.10, J 3.0 Max 1812: Tapesize 3.660.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 8.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 4.0 Max | ||||
| Paper Tape Reel Packing | 1005: Papersize W1 0.240.02, L1 0.450.02, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t 0.30 Below 0201: Papersize W1 0.370.10, L1 0.670.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t 0.80 Below 0402: Papersize W1 0.650.10, L1 1.150.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t 0.80 Below 0603: Papersize A 1.100.10, B 1.900.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max 0805: Papersize A 1.450.15, B 2.300.15, C 8.00.15, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max 1206: Papersize A 1.800.20, B 3.400.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max | ||||
| Reel Dimensions | 7REEL: 1782.0, A 3.0, B 130.5, C 210.5, D 21 or Bigger, E 1010.5, F 12max 13REEL: 3302.0, A 3.0, B 130.5, C 210.5, D 21 or Bigger, E 1010.5, F 12max | ||||
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping, (b) Embossed Taping | |||
| Packing Quantity | Paper T/R: 0603: 4000 pcs 0805: 4000 pcs 1206: --- Plastic T/R: 0805: 3000 pcs (T1.35mm) 1206: 3000 pcs (T1.60mm) 1210: 2000 pcs (T1.85mm) 1808: 1000 pcs (T1.85mm) 1812: 800 pcs (T1.85mm) 1812: 500 pcs | ||||
| Soldering Method | 1005: NPO/X7R/X5R/X7S/X6S/Y5V: R 0201: NPO/X7R/X5R/X7S/X6S/Y5V: R 0402: NPO/X7R/X5R/X7S/X6S/Y5V: R 0603: NPO: R/W, X7R/X5R/X7S/X6S: C1uf R, C1uf R/W, Y5V: C1uf R, C1uf R/W 0805: NPO: R/W, X7R/X5R/X7S/X6S: C4.7uf R, C4.7uf R/W, Y5V: C1uf R, C1uf R/W 1206: NPO: R/W, X7R/X5R/X7S/X6S: C10uf R, C10uf R/W, Y5V: C10uf R, C10uf R/W 1210: NPO/X7R/X5R/X7S/X6S/Y5V: R RReflow Soldering, WWave Soldering | ||||
Note 1: X7R/X5R/X6S/X7S/Y5V DF Exception table is provided in the original document.
Note: NO3, 11, 12, 13 initial capacitance testing: Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature.
Precautions for Use: MLCCs may fail in a short circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. Follow safety precautions and application notes. Contact engineering for handling questions.
Soldering Profile: Follow the temperature profile in the adjacent graph to avoid cracks from sudden temperature changes.
Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature contact.
Optimum Solder Amount for Reflow Soldering: Recommended soldering amounts are detailed in the original document.
Soldering Temperature Profile: During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.
2509251626_AIDE-CAPACITOR-0603X7R106M6R3NT_C49326611.pdf
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