Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, ensuring reliable performance across a range of operating conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- RoHS/REACH Compliance: Meets standard
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Application Field | High voltage circuits | |
| Function | Coupling, wave filtering, resonant | |
| Examples | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |
| Testing Conditions | Normal | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Testing Conditions | Relative | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa |
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | e.g., 8R0=8.0pF, 100=10pF, 101=100pF | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | e.g., 250=25V, 251=250V, 252=2500V | |
| Terminal Composition | Au/Ag-Ni-Sn | |
| Packing | T (Tape/Reel), P (Bag packing) | |
| Construction | Item | Description |
| 1 | Ceramic dielectric | |
| 2 | Inner electrode | |
| 3 | Outer electrode | |
| 4 | Nickle layer | |
| 5 | Tin layer | |
| Dimensions (mm) | Part Number | L Tol |
| 0201 (0603) | 0.60 0.10 | |
| 0402 (1005) | 1.00 0.15 | |
| 0603 (1608) | 1.60 0.20 | |
| 0805 (2012) | 2.00 0.20 | |
| 1206 (3216) | 3.20 0.30 | |
| 1210 (3225) | 3.20 0.30 | |
| 1808 (4520) | 4.50 0.40 | |
| 1812 (4532) | 4.50 0.40 | |
| 1825 (4563) | 4.50 0.40 | |
| 2220 (5750) | 5.70 0.50 | |
| 2225 (5763) | 5.70 0.50 | |
| Specifications & Testing | Temperature Range | -55~+125 |
| Insulation Resistance (IR) | NPO: 50000M (C10nF), 500S (C>10nF); X7R/X7T/X7P: 10000M (C25nF), 100S (C>25nF) | |
| Hi-pot (DC) | 1.1x to 2.5x rated voltage depending on Ur | |
| Solderability | Soldering area 90% | Pre-heating: 80-120 (10-30s), Soldering: 2455 (20.5s) |
| Resistance to Heat of Soldering | No damage, soldering area 90% | Pre-heating: 100-200 (102s), Soldering: 2655 (51s) |
| Flexural Strength | Electrostatic capacity change rate 10% | Flexural depth: 1mm |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N (101s) |
| Thermal Shock | Capacity change rate: NPO 2.5%, X7R/X7P 0.5%, X7T 10% | 5 cycles |
| Temperature Moisture Exposure | Capacity change rate: NPO 2% (1pF), X7R/X7T/X7P 10%; DF 2x initial standard; IR: NPO 2500M, X7R/X7T/X7P 1000M | 402, 90~95%RH, 50024 hours |
| High Temperature Exposure | Capacity change rate: NPO 2% (1pF), X7R/X7T/X7P 20%; DF 2x initial standard; IR: NPO 4000M, X7R/X7T/X7P 2000M | 1253, 100048 hours, Voltage: 100V-1KV (1.2x to 2x rated voltage) |
| PCB Flexural Strength | No crack and other defect | Various dimensions (A, B, C) based on MLCC size |
| Embossed Plastic Taping | Tape Sizes | 0805, 1206, 1210, 1808, 1812 |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | |
| Paper Tape Reel Packing | Sizes | 1005, 0201, 0402, 0603, 0805, 1206 |
| Reel Dimensions | 7' REEL (1782.0mm), 13' REEL (3302.0mm) | |
| Packing Quantity | Paper T/R | 4000 pcs (0805, 0402), 2000 pcs (0603), 1000 pcs (0805), 800 pcs (1206) |
| Plastic T/R | 3000 pcs (0805, 1206), 2000 pcs (1210, 1812), 1000 pcs (1812+), 500 pcs (1812++) | |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) | Recommended methods vary by size, capacitance, and temperature characteristic |
| Soldering Temperature Profile | Preheating temperature difference T 150 | Details in graph (not provided in text) |
2509251626_AIDE-CAPACITOR-1206X5R107M6R3NT_C49326745.pdf
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