Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description/Specification | Details | |||
|---|---|---|---|---|---|
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R0 (8.0 pF), 100 (10 pF), 101 (100 pF) | ||||
| Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | ||||
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | ||||
| Terminal Composition | Au/Ag-Ni-Sn | ||||
| Packing | T (Tape/Reel), P (Bag packing) | ||||
| Construction | 1. Ceramic dielectric | - | |||
| 2. Inner electrode | - | ||||
| 3. Outer electrode | - | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Testing Conditions | Normal Condition | Temp: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temp: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Specifications and Testing Methods | Temperature Range | -55~+125 | |||
| Visual/Dimension | No Damage, Dimension meet Spec | ||||
| Static Capacity | Meets standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | ||||
| Dissipation Factor (DF) | See Note 1 for X7R/X5R/X6S/X7S/Y5V characteristics. NPO characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). | ||||
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | ||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | |||
| Solderability | Soldering area90%, Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | - | |||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | - | |||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate C/C10%. | - | |||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | - | |||
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. Run 5 cycles. Test after 242 hours normal temp & humidity. | - | |||
| Temperature Moisture Exposure | Visual No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). Test at 402, 90~95%RH for 50024 hours. | - | |||
| High Temperature Exposure | Visual No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). Test at 1253 for 100048 hours with specified voltages. | - | |||
| PCB Flexural Strength | No crack and other defect. IR. | Dimensions A, B, C vary by size (e.g., 0805: 1.2, 4, 1.65). | |||
| Embossed Plastic Taping | Details for tape size (A, B, C, D, E, F, G, H, J) provided for sizes 0805 to 1812. | - | |||
| Paper Tape Reel Packing | Details for paper size (W1, L1, D, C, B, P1, P2, P0, d, t) provided for sizes 1005, 0201, 0402, 0603, 0805, 1206. | - | |||
| Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | - | |||
| Top Tape Peeling Strength | Paper Taping: 0.1N < peeling strength < 0.7N. Embossed Taping: Standard: 0.1N < peeling strength < 0.7N. | - | |||
| Packing Quantity | Paper T/R (Pcs): 4000 (0603, 0805), 3000 (1206). Plastic T/R (Pcs): 3000 (T1.35mm for 1206), 2000 (T1.60mm for 1210), 1000 (T1.85mm for 1812), 800 (1812+), 500 (1812+). | - | |||
| Soldering Method Recommendation | R - Reflow Soldering, W - Wave Soldering. Specific recommendations based on size, temperature characteristic, rated voltage, and capacitance. | - |
2509251626_AIDE-CAPACITOR-0603X7R104K250NT_C48579280.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible