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Specifications
Voltage Rating:
35V
Capacitance:
2.2uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R225K350NT
Model Number:
0805X7R225K350NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, ensuring reliable performance across a range of operating conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Application Field | |||
| Coupling, wave filtering, resonant in high voltage circuits | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||
| 2. Testing Conditions | |||
| 2.1 Normal Condition | Temperature | 15~35 | |
| Humidity | 45~75%RH | ||
| Normal Atmosphere | 86~106kPa | ||
| 2.2 Relative Condition | Temperature | 252 | |
| Humidity | 60~70%RH | ||
| Atmosphere | 86~106kPa | ||
| 3. Part Number Description | |||
| Item | Description | Example Codes | Details |
| 1. Dimension Code | Size (inch/mm) | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | Refer to detailed dimensions table |
| 2. Temperature Characteristic | Dielectric Type | C0G, X7R, X5R | C0G (030 PPM/), X7R (15%), X5R (15%) |
| 3. Nominal Electrostatic Capacity | Capacity Value (pF) | 8R0, 100, 101 | 8R0=8.0pF, 100=10pF, 101=100pF |
| 4. Tolerance of Electrostatic Capacity | Tolerance | B, C, D, F, G, J, K, M, Z | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% |
| 5. Rated Voltage (DC) | Voltage (V) | 250, 251, 252 | 250=25V, 251=250V, 252=2500V |
| 6. Terminal Composition | Plating | Au/Ag-Ni-Sn | (From the inside out) |
| 7. Packing | Packaging Type | T, P | T=Tape/Reel, P=Bag packing (PE) |
| 4. Construction and Dimension | |||
| Construction | Item | Description | |
| 1 | Ceramic dielectric | ||
| 2 | Inner electrode | ||
| 3 | Outer electrode | ||
| 4 | Nickel layer | ||
| 5 | Tin layer | ||
| Dimension | Part Number | Dimension (mm) - L W T WB | British System / Metric System |
| 0201 (0603) | 0.600.10 / 0.300.05 / 0.300.05 / 0.100.05 | ||
| 0402 (1005) | 1.000.15 / 0.500.15 / 0.500.10 / 0.200.10 | ||
| 0603 (1608) | 1.600.20 / 0.800.15 / 0.800.15 / 0.300.10 | 0.600.10 | |
| 0805 (2012) | 2.000.20 / 1.250.20 / 0.800.20 / 1.000.20 | 0.500.20 / 1.250.20 / 0.800.20 | |
| 1206 (3216) | 3.200.30 / 1.600.30 / 1.000.20 / 1.250.20 | 0.600.30 / 1.600.30 | |
| 1210 (3225) | 3.200.30 / 2.500.30 / 2.70 / 0.800.30 | ||
| 1808 (4520) | 4.500.40 / 2.000.20 / 2.70 / 0.800.30 | ||
| 1812 (4532) | 4.500.40 / 3.200.30 / 3.50 / 0.800.30 | ||
| 1825 (4563) | 4.500.40 / 6.300.50 / 3.50 / 0.800.30 | ||
| 2220 (5750) | 5.700.50 / 5.000.50 / 3.50 / 1.000.40 | ||
| 2225 (5763) | 5.700.50 / 6.300.50 / 6.20 / 1.000.40 | ||
| 5. Specification and Testing Method | |||
| Item | Specification/Requirement | Testing Method | |
| 1. Temperature | -55~+125 | ||
| 2. Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| 3. Static Capacity | Meet standard specification and tolerance | ||
| NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms | |||
| X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | |||
| 4. Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). Testing freq: 110%MHz (Cr1000pF), 110%KHz (Cr1000pF). Testing voltage: 1V0.2rms. | ||
| X7R/X7T/X7P: 10uF: 1KHz10%, 1V0.1rms; >10uF: 12024Hz, 0.5V0.1rms. See Note 1 for exceptions. | |||
| 5. IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C10nF). Testing condition: Rated voltage, 605s, Humidity:75%, Temp:255, Current:50mA. | ||
| X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF). | |||
| 6. Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | |
| 7. Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | Visual-No damage |
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual |
| 9. Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | |
| DF: Refer to NO#4. IR: Refer to NO#5. | |||
| 10. Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. | Visual |
| Electro static capacity change rate: C/C10% | Flexural depth: 452 | ||
| 11. Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| 12. Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |
| 13. Temperature moisture exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |
| 14. High temperature exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature. | |
| 15. PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. | IR |
| SIZE A B C | 0805(2012): 1.2 4 1.65; 1206(3216): 2.2 5 2; 1210(3225): 2.2 5 2.9; 1812(4532): 3.5 7 3.7; 2220(5750): 4.5 8 5.6 | ||
| 6. EMBOSSED PLASTIC TAPING | |||
| Embossed tape reel packing for 0805(2012)~1812(4532) type | Code | Tape size (mm) - A B C D E F G H J T | |
| 0805 | 1.550.20 / 2.350.20 / 8.000.20 / 3.500.05 / 1.750.10 / 4.000.10 / 2.000.10 / 4.000.10 / 1.50 -0/+0.10 / 1.50 Max | ||
| 1206 | 1.950.20 / 3.600.20 / 8.000.20 / 3.500.05 / 1.750.10 / 4.000.10 / 2.000.10 / 4.000.1 / 1.50 -0/+0.10 / 1.85 Max | ||
| 1210 | 2.700.10 / 3.420.10 / 8.000.10 / 3.500.05 / 1.750.10 / 4.000.10 / 2.000.05 / 4.000.10 / 1.55 -0/+0.10 / 3.2 Max | ||
| 1808 | 2.200.10 / 4.950.10 / 12.000.10 / 5.500.05 / 1.750.10 / 4.000.10 / 2.000.05 / 4.000.10 / 1.50 -0/+0.10 / 3.0 Max | ||
| 1812 | 3.660.10 / 4.950.10 / 12.000.10 / 5.500.05 / 1.750.10 / 8.000.10 / 2.000.05 / 4.000.10 / 1.55 -0/+0.10 / 4.0 Max | ||
| 7. Paper tape reel packing | |||
| Paper tape reel packing for 10050402~12063216 | Code | Paper size (mm) - W1 L1 D C B P1 P2 P0 d t | |
| 1005 | 0.240.02 / 0.450.02 / 8.000.10 / 3.500.05 / 1.750.10 / 2.000.05 / 2.000.05 / 4.000.10 / 1.50 -0/+0.10 / 0.30 Below | ||
| 0201 | 0.370.10 / 0.670.10 / 8.000.10 / 3.500.05 / 1.750.10 / 2.000.05 / 2.000.05 / 4.000.10 / 1.50 -0/+0.10 / 0.80 Below | ||
| 0402 | 0.650.10 / 1.150.10 / 8.000.10 / 3.500.05 / 1.750.10 / 2.000.05 / 2.000.05 / 4.000.10 / 1.50 -0/+0.10 / 0.80 Below | ||
| Paper tape reel packing for 0603, 0805, 1206 types | Code | Paper size (mm) - A B C D E F G H J T | |
| 0603 | 1.100.10 / 1.900.10 / 8.000.10 / 3.500.05 / 1.750.10 / 4.000.10 / 2.000.10 / 4.000.10 / 1.50 -0/+0.10 / 1.10 Max | ||
| 0805 | 1.450.15 / 2.300.15 / 8.00.15 / 3.500.05 / 1.750.10 / 4.000.10 / 2.000.10 / 4.000.10 / 1.50 -0/+0.10 / 1.10 Max | ||
| 1206 | 1.800.20 / 3.400.20 / 8.000.20 / 3.500.05 / 1.750.10 / 4.000.10 / 2.000.10 / 4.000.10 / 1.50 -0/+0.10 / 1.10 Max | ||
| 8. Reel Dimensions | |||
| 7' REEL | 1782.0 / 3.0 / 130.5 / 210.5 / 21 or Bigger / 1010.5 / 12max | A B C D E F G | (unit: mm) |
| 13' REEL | 3302.0 / 3.0 / 130.5 / 210.5 / 21 or Bigger / 1010.5 / 12max | A B C D E F G | (unit: mm) |
| 9. Taping specification | |||
| Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping, (b) Embossed Taping | |
| 10. Packing quantity | |||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | |
| 0603 | 4000 | - | |
| 0805 | 4000 | 3000 (T1.35mm) | |
| 1206 | - | 3000 (T>1.35mm) / 2000 (T1.60mm) | |
| 1210 | - | 3000 (T>1.60mm) / 2000 | |
| 1808 | - | 1000 (T1.85mm) | |
| 1812 | - | 1000 (T>1.85mm) / 800 | |
| 1812 | - | 500 | |
| 11. Precautions For Use | |||
| Soldering Profile | To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | ||
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature. | ||
| Optimum Solder Amount for Reflow Soldering | Recommended | ||
| Recommended Soldering Method | Size | Temperature Characteristics / Rated Voltage / Capacitance | Soldering Method |
| 1005 | NPO / / R; X7R/X5R/X7S/X6S / / R | R | |
| 0201 | NPO / / R; X7R/X5R/X7S/X6S / / R; Y5V / / R | R | |
| 0402 | NPO / / R; X7R/X5R/X7S/X6S / / R; Y5V / / R | R | |
| 0603 | NPO / / R/W; X7R/X5R/X7S/X6S / C1uf R C1uf R/W; Y5V / C1uf R C1uf R/W | R/W | |
| 0805 | NPO / / R/W; X7R/X5R/X7S/X6S / C4.7uf R C4.7uf R/W; Y5V / C1uf R C1uf R/W | R/W | |
| 1206 | NPO / / R/W; X7R/X5R/X7S/X6S / C10uf R C10uf R/W; Y5V / C10uf R C10uf R/W | R/W | |
| 1210 | NPO / / R; X7R/X5R/X7S/X6S / / R; Y5V / / R | R | |
| Soldering method | RReflow Soldering, WWave Soldering | ||
| The temperature profile for soldering | Keep temperature difference between soldering temperature and surface temperature of chips as: T150. | ||
2509251626_AIDE-CAPACITOR-0805X7R225K350NT_C49326714.pdf
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