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Specifications
Voltage Rating:
25V
Capacitance:
47uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
1206X5R476M250NT
Model Number:
1206X5R476M250NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of standard sizes and offer different temperature characteristics (C0G, X7R, X5R) with precise capacitance tolerances and rated voltages.
Product Attributes
- Material: Ceramic dielectric, inner and outer electrodes (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS/REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||||||
| Testing Conditions | ||||||||||
| Normal Condition | (Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa) | |||||||||
| Relative Condition | (Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa) | |||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||||
| 5. Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||
| 7. Packing | T Tape/Reel, P Bag packing(PE) | |||||||||
| Construction | ||||||||||
| Item | Description | |||||||||
| 1 | Ceramic dielectric | |||||||||
| 2 | Inner electrode | |||||||||
| 3 | Outer electrode | |||||||||
| 4 | Nickle layer | |||||||||
| 5 | Tin layer | |||||||||
| Dimension (mm) | ||||||||||
| Part number | L | W | T | |||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | |||||||
| Specification and Testing Method | ||||||||||
| 1. Temperature | -55~+125 | N/A | ||||||||
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||
| 3. Static Capacity | Meet standard specification and tolerance | See detailed specifications in source document | ||||||||
| 4. Dissipation Factor (DF) | See detailed specifications in source document | See detailed specifications in source document | ||||||||
| 5. IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF | Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA | ||||||||
| 6. Hi-pot (DC) | No dielectric breakdown or damage. Voltage based on rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time2S | ||||||||
| 7. Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | ||||||||
| 9. Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base boardAl2O3 /PCB. PCB dimension Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | ||||||||
| 10. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||
| 11. Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. | Run 5 cycles. Test after place 242 hours normal temp & humidity. | ||||||||
| 12. Temperature Moisture Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | ||||||||
| 13. High Temperature Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage based on rated voltage. Test after place 48 hours under normal pressure & temperature. | ||||||||
| 14. PCB Flexural Strength | No crack and other defect. | IR Soldering the MLCC on the PCB, then pressing. Dimensions A, B, C provided for different sizes. | ||||||||
| Embossed Plastic Taping Dimensions (mm) | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (mm) | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | ||||||||||
| Type | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Taping Specification | ||||||||||
| Top tape peeling strength | (a) Paper Taping: 0.1N < peeling strength < 0.7N (b) Embossed Taping: Standard: 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||
| Packing Quantity | ||||||||||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | |||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | 3000 (T1.35mm) | |||||||||
| 1210 | 2000 (T1.60mm) | |||||||||
| 1808 | 3000 (T1.60mm) | |||||||||
| 1812 | 2000 | |||||||||
| 1812 | 1000 (T1.85mm) | |||||||||
| 1000 (T1.85mm) | ||||||||||
| 800 | ||||||||||
| 500 | ||||||||||
| Precautions For Use | ||||||||||
| MLCCs may fail short circuit or open circuit mode under severe conditions beyond ratings, potentially leading to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering for handling questions. | ||||||||||
| 1. Soldering Profile | Follow the temperature profile graph to avoid cracks due to sudden temperature changes. | Refer to graph in enclosure page. | ||||||||
| 2. Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature. | N/A | ||||||||
| 3. Optimum Solder Amount for Reflow Soldering | N/A | N/A | ||||||||
| 4. Recommended Soldering amounts | N/A | N/A | ||||||||
| Recommended Soldering Method | ||||||||||
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | ||||||
| 1005 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| 0201 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| 0402 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| 0603 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| Y5V | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| 0805 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |||||||
| C4.7uf | R/W | |||||||||
| Y5V | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| 1206 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C10uf | R | |||||||
| C10uf | R/W | |||||||||
| Y5V | / | C10uf | R | |||||||
| C10uf | R/W | |||||||||
| 1210 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| Soldering method: RReflow Soldering, WWave Soldering | ||||||||||
| Soldering Temperature Profile | ||||||||||
| Preheating: Keep temperature difference between soldering temperature and surface temperature of chips as T150. | ||||||||||
2509251626_AIDE-CAPACITOR-1206X5R476M250NT_C49326754.pdf
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