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Specifications
Voltage Rating:
63V
Capacitance:
4.7uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1210X7R475K630NT
Model Number:
1210X7R475K630NT
Package:
1210
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Application Field | |||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||
| 2. Testing Conditions | |||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||
| 3. Part Number Description Example: 1812 X7R 684 M 251 N T | |||
| Item | Description | Code/Value | |
| 1 | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | (See Page 1 for L*W in inches and mm) |
| 2 | Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3 | Nominal Electrostatic Capacity | (pF) | 8R0=8.0, 100=10, 101=100 |
| 4 | Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5 | Rated Voltage (DC) | (V) | 250=25, 251=250, 252=2500 |
| 6 | Terminal Composition | Au/Ag-Ni-Sn | |
| 7 | Packing | T: Tape/Reel, P: Bag packing (PE) | |
| 4. Construction and Dimension | |||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | ||
| Dimension (mm) | (See Page 2 for detailed dimensions for each size code) | ||
| 5. Specification and Testing Method | |||
| 1 | Temperature | -55~+125 | |
| 2 | Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| 3 | Static Capacity | Meet standard specification and tolerance | (See Page 3 for NPO and X7R/X7T/X7P characteristics, frequency, and voltage) |
| 4 | Dissipation Factor (DF) | (See Page 3 for NPO and X7R/X7T/X7P characteristics, frequency, and voltage) | |
| 5 | IR Insulation Resistance | (See Page 3 for NPO and X7R/X7T/X7P characteristics, testing conditions) | |
| 6 | Hi-pot (DC) | No dielectric breakdown or damage | (See Page 3 for voltage ratings and test conditions) |
| 7 | Solderability | Soldering area 90% | (See Page 5 for pre-heating, solder, and cleaning conditions) |
| 8 | Resistance to the heat of soldering | No visual damage, soldering area 90% | (See Page 5 for pre-heating, solder, cleaning, and exposure conditions) |
| 9 | Flexural Strength | (See Page 5 for test conditions and electrostatic capacity change rate) | |
| 10 | Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| 11 | Thermal Shock | (See Page 6 for NPO, X7R/X7P, X7T characteristics and test cycles) | |
| 12 | Temperature Moisture Exposure | (See Page 6 for test conditions, electrostatic capacitance change rate, DF, and IR) | |
| 13 | High Temperature Exposure | (See Page 6 for test conditions, electrostatic capacitance change rate, DF, and IR) | |
| 14 | PCB Flexural Strength | No crack and other defect | (See Page 7 for test conditions and IR) |
| 6. Embossed Plastic Taping | |||
| Embossed Tape Reel Packing | (See Page 8 for dimensions for 0805 to 1812 types) | ||
| 7. Paper Tape Reel Packing | |||
| Paper Tape Reel Packing | (See Page 9 for dimensions for 1005, 0201, 0402, 0603, 0805, 1206 types) | ||
| 8. Packing Quantity | |||
| Packing Quantity | (See Page 11 for Paper T/R and Plastic T/R quantities by size) | ||
| 9. Precautions For Use | |||
| Soldering Profile | Follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | ||
| Manual Soldering | Handle soldering iron carefully, pay attention to tip selection and temperature contact. | ||
| Recommended Soldering Method | (See Page 13 for size, temperature characteristics, rated voltage, capacitance, and soldering method R/W) | ||
| Soldering Temperature Profile | Keep temperature difference T 150 between soldering temperature and surface temperature of chips during preheating. | ||
2509251626_AIDE-CAPACITOR-1210X7R475K630NT_C49326825.pdf
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