Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonance in various high-voltage circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage requirements.

Product Attributes

Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
Certifications: ROHS/REACH compliance

Technical Specifications

Item	Description/Specification	Testing Method
Testing Conditions
Normal Condition	Temperature: 15~35 Humidity: 45~75%RH Atmosphere: 86~106kPa	N/A
Relative Condition	Temperature: 252 Humidity: 60~70%RH Atmosphere: 86~106kPa	N/A
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code	0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225	See Dimension Table
2. Temperature Characteristic	C0G (030 PPM/), X7R (15%), X5R (15%)	See Specification Section
3. Nominal Electrostatic Capacity	8R0=8.0pF, 100=10pF, 101=100pF	See Specification Section
4. Tolerance of Electrostatic Capacity	B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20%	See Specification Section
5. Rated Voltage (DC)	250=25V, 251=250V, 252=2500V	See Specification Section
6. Terminal Composition	Au/Ag-Ni-Sn	N/A
7. Packing	T (Tape/Reel), P (Bag packing)	N/A
Construction
Item	Description	N/A
1	Ceramic dielectric	N/A
2	Inner electrode	N/A
3	Outer electrode	N/A
4	Nickle layer	N/A
5	Tin layer	N/A
Dimension (mm)
Part Number	L	W	T	WB
0201 (0603)	0.600.10	0.300.05	0.300.05	0.100.05
0402 (1005)	1.000.15	0.500.15	0.500.10	0.200.10
0603 (1608)	1.600.20	0.800.15	0.800.15	0.300.10
0805 (2012)	2.000.20	1.250.20	0.800.20	0.500.20
1206 (3216)	3.200.30	1.600.30	1.000.20	0.600.30
1210 (3225)	3.200.30	2.500.30	2.70	0.800.30
1808 (4520)	4.500.40	2.000.20	2.70	0.800.30
1812 (4532)	4.500.40	3.200.30	3.50	0.800.30
1825 (4563)	4.500.40	6.300.50	3.50	0.800.30
2220 (5750)	5.700.50	5.000.50	3.50	1.000.40
2225 (5763)	5.700.50	6.300.50	6.20	1.000.40
Specification and Testing Method
Item	Specification/Requirement	Testing Method
1. Temperature	-55~+125	N/A
2. Visual/Dimension	1. No Damage 2. Dimension meet Spec	Naked eye (Visual inspection) Digital calliper
3. Static Capacity	Meet standard specification and tolerance	See details in source
4. Dissipation Factor (DF)	See details in source	See details in source
5. IR Insulation Resistance	See details in source	See details in source
6. Hi-pot (DC)	See details in source	See details in source
7. Solderability	Soldering area 90%	See details in source
8. Resistance to the heat of soldering	Visual-No damage, soldering area 90%	See details in source
9. Flexural Strength	No damage Electro static capacity change rate C/C10%	See details in source
10. Terminal Bonding Strength	No visual damage	Applied Force: 5N, Duration: 101S
11. Thermal Shock	See details in source	See details in source
12. Temperature Moisture Exposure	See details in source	See details in source
13. High Temperature Exposure	See details in source	See details in source
14. PCB Flexural Strength	No crack and other defect	See details in source
Embossed Plastic Taping Dimensions (mm)
Code	Tape size A	B	C	D	E	F	G	H	J	T
0805	1.55 0.20	2.35 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.50 Max
1206	1.95 0.20	3.60 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.1	1.50 -0/+0.10	1.85 Max
1210	2.70 0.10	3.42 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	3.2 Max
1808	2.20 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.50 -0/+0.10	3.0 Max
1812	3.66 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	8.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	4.0 Max
Paper Tape Reel Packing Dimensions (mm)
Code	Paper size W1	L1	D	C	B	P1	P2	P0	d	t
1005	0.240.02	0.450.02	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.30 Below
0201	0.370.10	0.670.10	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.80 Below
0402	0.650.10	1.150.10	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.80 Below
Code	Paper size A	B	C	D	E	F	G	H	J	T
0603	1.10 0.10	1.90 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
0805	1.45 0.15	2.30 0.15	8.0 0.15	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
1206	1.80 0.20	3.40 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
Reel Dimensions (unit: mm)
Type	A	B	C	D	E	F	G
7REEL	1782.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max
13REEL	3302.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max
Taping Specification
Item	Specification	Testing Method
Top tape peeling strength	0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.	N/A
Packing Quantity
Dimension	Paper T/R (Pcs)	Plastic T/R (Pcs)
0603	4000	-
0805	4000	3000 (T1.35mm)
1206	-	3000 (T1.60mm) / 2000 (T1.60mm)
1210	-	3000 (T1.60mm) / 2000 (T1.60mm)
1808	-	1000 (T1.85mm)
1812	-	1000 (T1.85mm) / 800 (T1.85mm)
1812 above	-	500
Precautions For Use
The Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit mode when subjected to severe conditions of electrical environment and / or mechanical stress beyond the specified rating and specified conditions in the specification, which will result in burn out, flaming or glowing in the worst case. Following precautions for safety and Application Notes shall be taken in your major consideration. If you have a question about the precautions for handling, please contact our engineering section or factory.
1. Soldering Profile	To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page).
2. Manual Soldering	Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip.
3. Optimum Solder Amount for Reflow Soldering	N/A
4. Recommended Soldering amounts	N/A
Recommended Soldering Method
Size	Temperature Characteristics	Rated Voltage	Capacitance	Soldering Method
1005	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
0201	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0402	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0603	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C1uf	R
		/	C1uf	R/W
	Y5V	/	C1uf	R
		/	C1uf	R/W
0805	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C4.7uf	R
		/	C4.7uf	R/W
	Y5V	/	C1uf	R
		/	C1uf	R/W
1206	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C10uf	R
		/	C10uf	R/W
	Y5V	/	C10uf	R
		/	C10uf	R/W
1210	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
Soldering method: RReflow Soldering WWave Soldering
The temperature profile for soldering
While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-0603X7R105K250NT_C48579283.pdf

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