Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. These MLCCs are engineered for medium and high voltage requirements.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets standards
Technical Specifications
| Item | Description/Specification | Details |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |
| Switch power supplier | ||
| AC-DC power charger | ||
| DC-DC power charger | ||
| Networking/Communication interface | ||
| LCD backlight unit power supplier | ||
| Amperite of energy saving lamps | ||
| (Medium and High voltage MLCC) | ||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Initial Capacitance Testing | Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature. | |
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | e.g., 8R0=8.0pF, 100=10pF, 101=100pF | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | e.g., 250=25V, 251=250V, 252=2500V | |
| Packing | T: Tape/Reel, P: Bag packing (PE) | |
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer |
| Dimension (mm) - British System (Code) | L x W (inch) | |
| 0201 (0603) | 0.02*0.01 (0.50*0.25) | |
| 0402 (1005) | 0.04*0.02 (1.00*0.50) | |
| 0603 (1608) | 0.06*0.03 (1.60*0.80) | |
| 0805 (2012) | 0.08*0.05 (2.00*1.25) | |
| 1206 (3216) | 0.12*0.06 (3.20*1.60) | |
| 1210 (3225) | 0.12*0.10 (3.20*2.50) | |
| 1808 (4520) | 0.18*0.08 (4.50*2.00) | |
| 1812 (4532) | 0.18*0.12 (4.50*3.20) | |
| 1825 (4563) | 0.18*0.25 (4.50*6.30) | |
| 2211 (5728) | 0.22*0.11 (5.70*2.8) | |
| 2225 (5763) | 0.22*0.25 (5.70*6.30) | |
| Dimension (mm) - Metric System | Part Number | L (mm) Tol, W (mm) Tol, T (mm) Tol, WB (mm) Tol |
| 0201 (0603) | 0.600.10, 0.300.05, 0.300.05, 0.100.05 | |
| 0402 (1005) | 1.000.15, 0.500.15, 0.500.10, 0.200.10 | |
| 0603 (1608) | 1.600.20, 0.800.15, 0.800.15, 0.300.10 | |
| 0805 (2012) | 2.000.20, 1.250.20, 0.800.20, 1.000.20 | |
| 1206 (3216) | 3.200.30, 1.600.30, 1.000.20, 1.250.20 | |
| 1210 (3225) | 3.200.30, 2.500.30 (2.70), 0.800.30 | |
| 1808 (4520) | 4.500.40, 2.000.20 (2.70), 0.800.30 | |
| 1812 (4532) | 4.500.40, 3.200.30 (3.50), 0.800.30 | |
| 1825 (4563) | 4.500.40, 6.300.50 (3.50), 0.800.30 | |
| 2220 (5750) | 5.700.50, 5.000.50 (3.50), 1.000.40 | |
| 2225 (5763) | 5.700.50, 6.300.50 (6.20), 1.000.40 | |
| Specifications and Testing Methods | Temperature Range | -55~+125 |
| Visual/Dimension | No Damage, Dimension meet Spec | |
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |
| Dissipation Factor (DF) | NPO: Varies by capacitance. X7R/X7T/X7P: Varies by capacitance. | |
| Insulation Resistance (IR) | NPO: IR50000M, IR*Cr500S (C10nF); IR10000M, IR*Cr100S (C>10nF). X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, 605s, Humidity:75%, Temp:255, Current:50mA. | |
| Hi-pot (DC) | No dielectric breakdown or damage. Voltage test based on rated voltage (Ur). | |
| Solderability | Soldering area90%, Visual-No damage. Pre-heating 80-120 (10-30s), Solder temp 2455 (20.5s). | |
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating 100-200 (102s), solder temp 2655 (51s). Cleaning with solvent. Room temp, 242 hours. | |
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF. X7R: 15%. X7T: -33% to 22%. X7P: 10%. | |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electrostatic capacity change rate: 10%. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | |
| Thermal Shock | NPO: 2.5% or 0.25pF. X7R/X7P: 0.5%. X7T: 10%. 5 cycles. | |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO 2% or 1pF. X7R/X7T/X7P 10%. DF 2 times initial standard. IR: NPO IR2500M or IR*Cr25S. X7R/X7T/X7P IR1000M or IR*Cr25S. (402, 90~95%RH, 50024 hours). | |
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO 2% or 1pF. X7R/X7T/X7P 20%. DF 2 X initial standard. IR: NPO IR4000M or IR*Cr40S. X7R/X7T/X7P IR2000M or IR*Cr50S. (1253, 100048 hours, Voltage based on rated voltage). | |
| PCB Flexural Strength | No crack and other defect. IR tested. | |
| Embossed Plastic Taping | Taping Specification | Dimensions A, B, C, D, E, F, G, H, J, T for various sizes (0805 to 1812). |
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0). | |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. | |
| Paper Tape Reel Packing | Paper Tape Reel Packing (1005, 0201, 0402 types) | Dimensions W1, L1, D, C, B, P1, P2, P0, d, t. |
| Paper Tape Reel Packing (0603, 0805, 1206 types) | Dimensions A, B, C, D, E, F, G, H, J, T. | |
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0). | |
| Packing Quantity | Varies by size and tape type (Paper T/R, Plastic T/R). | |
| Soldering Method | RReflow Soldering, WWave Soldering. Recommended methods vary by size, temperature characteristic, rated voltage, and capacitance. | |
| Soldering Temperature Profile | Preheating temperature difference T 150. | |
2509251626_AIDE-CAPACITOR-0603X7R105K500NT_C48579284.pdf
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