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Specifications
Voltage Rating:
35V
Capacitance:
10uF
Temperature Coefficient:
X6S
Tolerance:
±10%
Mfr. Part #:
0805X6S106K350NT
Model Number:
0805X6S106K350NT
Package:
0805
Key Attributes
Product Description
0805(X6S) Chip Ceramic Capacitor Datasheet
Product Overview
This specification sheet applies to high-voltage chip ceramic capacitors (MLCC type) used for coupling, filtering, and resonance in high-voltage electronic circuits. Applications include switching power supplies, AC-DC power converters, DC-DC power converters, network/communication interfaces, LCD module backlight power supplies, and energy-saving lamp ballasts.
Product Attributes
- Temperature Characteristics: C0G (030 PPM/), X7R (15%), X6S (22%)
- Terminal Material: Copper/Silver-Nickel-Tin (from inside to outside)
- Environmental Compliance: RoHS Directive, REACH Directive (compliant with the latest requirements for Substances of Very High Concern (SVHC) issued by ECHA)
Technical Specifications
| Item | Specification | Test Method |
|---|---|---|
| Application Range | High-voltage electronic circuits for coupling, filtering, resonance. Applications include switching power supplies, AC-DC power converters, DC-DC power converters, network/communication interfaces, LCD module backlight power supplies, and energy-saving lamp ballasts. | - |
| Standard Conditions | Normal Temperature: 15~35 Normal Humidity: 45~75%RH Normal Pressure: 86~106kPa | - |
| Standard Relative Conditions | Normal Temperature: 252 Normal Humidity: 60~70%RH Normal Pressure: 86~106kPa | Used when there is doubt or special requirements for measurements under standard conditions. |
| Product Code Structure | Example: 0805 X6S 105 K 160 N T Product Size Code Temperature Characteristic Nominal Capacitance Capacitance Tolerance Rated Voltage (DC) Terminal Material Packaging Method | - |
| Product Structure | Ceramic Dielectric Internal Electrode External Electrode Nickel Layer Tin Layer | - |
| Product Dimensions (0805 / 2012) | L: 2.000.20 mm (0.080.01 inch) W: 1.250.20 mm (0.050.01 inch) T: 0.800.20 mm (0.030.01 inch) WB: 1.000.20 mm (0.040.01 inch) | - |
| Operating Temperature Range | -55~+105 | Visual inspection of appearance. Caliper measurement of dimensions. |
| Appearance and Dimensions | 1. No visible damage. 2. Dimensions meet specification requirements. | Visual inspection of appearance. Caliper measurement of dimensions. |
| Capacitance | Within specified tolerance. NPO Characteristics: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms X7R/X7T/X5R Characteristics: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms | - |
| Dissipation Factor (DF Value) | NPO Characteristics: DF0.56% (Cr5 pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X5R/X6S/X7S/Y5V Characteristics: See Note 1. Measurements at 110%MHz, 1V0.2rms for Cr1000pF; 110%KHz, 1V0.2rms for Cr1000pF (NPO). Measurements at 110%KHz, 1V0.1rms for Cr10uF; 12024Hz, 0.5V0.1rms for Cr10uF (X7R/X5R/X6S/X7S/Y5V). | - |
| Insulation Resistance | NPO Characteristics: IR50000M (C10nF); IR*Cr500S (C10nF) X7R/X6S/X5R Characteristics: IR10000M (C25nF); IR*Cr100S (C25nF) Test voltage: 500V (Rated voltage 500V); Rated voltage (Rated voltage 500V). Test time: 605 sec. Test humidity: 75%. Test temperature: 255. Test charge/discharge current: 50mA. | - |
| Dielectric Strength (DC) | No dielectric breakdown or damage. 2.5x Rated Voltage (Ur=100V) 2.0x Rated Voltage (Ur=200V/250V) 1.5x Rated Voltage (Ur=450/500/630V) 1.2x Rated Voltage (1KVUr2KV) 1.1x Rated Voltage (2KVUr) Ramp time: 1-10S. Holding time: 2S. | - |
| Solderability | >90% tinning rate. No visible damage. Preheat at 80-120 for 10-30 seconds. Lead-free solder, flux used. Solder temperature: 2455. Soldering time: 20.5 seconds. | - |
| Soldering Heat Resistance | No visible damage, >90% tinning rate. Preheat at 100-200 for 102 seconds. Immersion temperature: 2605. Immersion time: 51 seconds. Clean with solvent. Room temperature, holding time: 242 hours. | - |
| Capacitance Change Rate (Soldering Heat Resistance) | NPO: |C/C|0.5% or 0.5pF (take the larger value) X7R: |C/C|15% X7T: -33% C/C22% X6S: |C/C|22% | - |
| DF Value (Soldering Heat Resistance) | See Item No. 4 | - |
| IR (Soldering Heat Resistance) | See Item No. 5 | - |
| Bending Strength | No visible damage. Test substrate: Al2O3 or PCB. PCB dimensions: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Bending depth: 1mm. Loading speed: 0.5mm/sec. Measurements are taken in a bent state. | - |
| Capacitance Change Rate (Bending Strength) | |C/C|10% | - |
| Terminal Bond Strength | No visible damage. | - |
| Temperature Cycling | NPO: |C/C|2.5% or 0.25pF (take the larger value) X7R/X5R: |C/C|7.5% X6S: |C/C|10% Pre-treatment (X7R characteristics): Upper temperature for 1 hour, hold for 241 hours, initial measurement. 5 temperature cycles. Hold for 242 hours at room temperature and humidity before testing. Steps: Lower temp (303 min), Room temp (2-3 min), Upper temp (303 min), Room temp (2-3 min). | - |
| Humidity Resistance | No visible damage. Hold for 24 hours at room temperature and humidity after test. Temperature: 402. Humidity: 90~95%RH. Time: 50024 hours. | - |
| Capacitance Change Rate (Humidity Resistance) | NPO: |C/C|2% or 1pF (take the larger value) X7R/X6S/X5R: |C/C|10% | - |
| DF Value (Humidity Resistance) | 2 times the initial standard. | - |
| IR (Humidity Resistance) | NPO: IR2500M or IR*Cr25S (take the smaller value) X7R/X6S/X5R: IR1000M or IR*Cr25S (take the smaller value) | - |
| High Temperature Load Test | No visible damage. Hold for 484 hours at room temperature and humidity before testing. Temperature: 853. Time: 100048 hours. Voltage: 2x Rated Voltage (100VV250V); 1.5x Rated Voltage (250VV1KV); 1.2x Rated Voltage (1KVV). Charge/discharge current limited to below 50mA. | - |
| Capacitance Change Rate (High Temp Load) | NPO: |C/C|2% or 1pF (take the larger value) X7R/X6S/X5R: |C/C|20% | - |
| DF Value (High Temp Load) | 2 times the initial standard. | - |
| IR (High Temp Load) | NPO: IR4000M or IR*Cr40S (take the smaller value) X7R/X6S/X5R: IR2000M or IR*Cr50S (take the smaller value) | - |
| Circuit Board Bending Performance | No cracks or other defects. Capacitors soldered to fixture (glass-epoxy resin) using mixed solder. Force applied as shown in Figure 2 after soldering. Soldering should be done by reflow to avoid uneven soldering and thermal shock. | - |
| Packaging Options | T: Tape packaging P: Bulk packaging (PE bag) | - |
| Packaging Dimensions (Tape & Reel) | See pages 8-10 for detailed dimensions for various product sizes (0805 to 1812 for plastic reel, 0201 to 1206 for paper tape). | - |
| Packaging Quantity | 0805: 3000 pcs (Tape) 1206: 3000 pcs (Tape) 1210: 2000 pcs (Tape, T1.35mm), 3000 pcs (Tape, T>1.35mm) 1808: 2000 pcs (Tape, T1.60mm) 1812: 3000 pcs (Tape, T>1.60mm), 2000 pcs (Tape, T1.85mm), 1000 pcs (Tape, T>1.85mm) 1812 and above: 800 pcs, 500 pcs | - |
Note 1: Refer to page 6 for detailed DF exceptions for X7R/X5R/X6S/X7S/Y5V characteristics across various rated voltages and capacitance values.
Note: Initial measurement of capacitance for items NO3, 11, 12, 13: Pre-heat at 150 for 1 hour, then condition at room temperature and humidity for 48 hours before testing.
2507091655_AIDE-CAPACITOR-0805X6S106K350NT_C49326693.pdf
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