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Specifications
Voltage Rating:
630V
Capacitance:
10nF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
1206C0G103J631NT
Model Number:
1206C0G103J631NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and energy-saving lamp circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, inner and outer electrodes (Au/Ag-Ni-Sn terminal composition)
- Compliance: RoHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC). | - |
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | - |
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | - |
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing | - |
| Dimension Codes (L*W) | 0201 (0.02*0.01 inch / 0.50*0.25 mm) 0402 (0.04*0.02 inch / 1.00*0.50 mm) 0603 (0.06*0.03 inch / 1.60*0.80 mm) 0805 (0.08*0.05 inch / 2.00*1.25 mm) 1206 (0.12*0.06 inch / 3.20*1.60 mm) 1210 (0.12*0.10 inch / 3.20*2.50 mm) 1808 (0.18*0.08 inch / 4.50*2.00 mm) 1812 (0.18*0.12 inch / 4.50*3.20 mm) 1825 (0.18*0.25 inch / 4.50*6.30 mm) 2211 (0.22*0.11 inch / 5.70*2.8 mm) 2225 (0.22*0.25 inch / 5.70*6.30 mm) | - |
| Temperature Characteristic Codes | C0G (030 PPM/), X7R (15%), X5R (15%) | - |
| Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | - |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | - |
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | - |
| Terminal Composition | Au/Ag-Ni-Sn (From inside out) | - |
| Packing | T: Tape/Reel, P: Bag packing (PE) | - |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | - |
| Dimensions (mm) | 0201 (0603): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 0402 (1005): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 0603 (1608): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10, 0.600.10 0805 (2012): L 2.000.20, W 1.250.20, T 0.800.20, WB 1.000.20, 0.500.20, 1.250.20, 0.800.20 1206 (3216): L 3.200.30, W 1.600.30, T 1.000.20, WB 1.250.20, 0.600.30, 1.600.30 1210 (3225): L 3.200.30, W 2.500.30, T 2.70, WB 0.800.30 1808 (4520): L 4.500.40, W 2.000.20, T 2.70, WB 0.800.30 1812 (4532): L 4.500.40, W 3.200.30, T 3.50, WB 0.800.30 1825 (4563): L 4.500.40, W 6.300.50, T 3.50, WB 0.800.30 2220 (5750): L 5.700.50, W 5.000.50, T 3.50, WB 1.000.40 2225 (5763): L 5.700.50, W 6.300.50, T 6.20, WB 1.000.40 | Digital calliper |
| Temperature Characteristic | -55~+125 | - |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| Static Capacity | NPO: 1000pF 1MHz10%, 1.00.2Vrms; >1000pF 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF 1KHz10%, 1.00.2Vrms; >10uF 120Hz24, 0.50.1Vrms | - |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms | - |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF (Rated voltage, 605s, Humidity:75%, Temp:255, Current:50mA) X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | - |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage (Voltage Raising time: 110S, Voltage maintaining time2S) | - |
| Solderability | Soldering area90% | Pre-heating 80-120 (10-30s), Lead free solder, flux. Soldering temp 2455 (20.5s) |
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating 100-200 (102s), Soldering temp 2655 (51s). Cleaning, Room temp (242 hours) |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Pre-heating 150 (1 hour), then 48 hours under normal conditions. |
| Flexural Strength | No damage, Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB (Thickness: 1.6mm, Length: 100mm, Width: 40mm), Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | 5 cycles. Test after 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temp 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hours normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temp 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect. IR | MLCC soldered on PCB, pressing direction based on photo. |
| Embossed Plastic Taping Dimensions | 0805: Tapesize 1.550.20, A 2.350.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.10, H 1.50 -0/+0.10, J 1.50 Max. 1206: Tapesize 1.950.20, A 3.600.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.1, H 1.50 -0/+0.10, J 1.85 Max. 1210: Tapesize 2.700.10, A 3.420.10, B 8.000.10, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 3.2 Max. 1808: Tapesize 2.200.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.50 -0/+0.10, J 3.0 Max. 1812: Tapesize 3.660.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 8.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 4.0 Max. | - |
| Paper Tape Reel Packing Dimensions | 1005: W1 0.240.02, L1 0.450.02, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.30. 0201: W1 0.370.10, L1 0.670.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80. 0402: W1 0.650.10, L1 1.150.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80. 0603: A 1.100.10, B 1.900.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max. 0805: A 1.450.15, B 2.300.15, C 8.00.15, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max. 1206: A 1.800.20, B 3.400.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max. | - |
| Reel Dimensions | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | - |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | - |
| Packing Quantity | 0603: Paper T/R (Pcs) 4000 0805: Paper T/R (Pcs) 4000, Plastic T/R (Pcs) 3000 1206: Paper T/R (Pcs) -, Plastic T/R (Pcs) T1.35mm 3000, T1.35mm 2000 1210: Plastic T/R (Pcs) T1.60mm 3000, T1.60mm 2000 1808: Plastic T/R (Pcs) 1000 1812: Plastic T/R (Pcs) T1.85mm 1000, T1.85mm 800 1812: Plastic T/R (Pcs) 500 | - |
| Soldering Profile | Follow the temperature profile graph. | - |
| Recommended Soldering Method | NPO, X7R/X5R/X7S/X6S, Y5V available for Reflow (R) and Wave (W) soldering depending on size and capacitance. | - |
| Soldering Temperature Profile | Preheating: Temperature difference between soldering temperature and surface temperature of chips T150. | - |
2509251626_AIDE-CAPACITOR-1206C0G103J631NT_C49326727.pdf
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