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Specifications
Voltage Rating:
10V
Capacitance:
100uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
1206X5R107M100NT
Model Number:
1206X5R107M100NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonance in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of dimensions and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, inner electrode, outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Certifications: ROHS/REACH compliant
Technical Specifications
| Item | Description | Specification | ||||||
|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |||||||
| Switch power supplier | ||||||||
| AC-DC power charger | ||||||||
| DC-DC power charger | ||||||||
| Networking/Communication interface | ||||||||
| LCD backlight unit power supplier | ||||||||
| Amperite of energy saving lamps | ||||||||
| Medium and High voltage MLCC | ||||||||
| Testing Conditions | Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||
| Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||
| Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |||||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||
| Packing | T Tape/Reel, P Bag packing(PE) | |||||||
| Construction | 1. Ceramic dielectric | - | ||||||
| 2. Inner electrode | - | |||||||
| 3. Outer electrode | - | |||||||
| 4. Nickle layer | - | |||||||
| 5. Tin layer | - | |||||||
| Dimension (mm) | Part Number | L | W | T | WB | |||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||
| Specification and Testing Method | Temperature | -55~+125 | - | |||||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000 pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||||||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 110%MHz, 1V0.2rms (Cr1000pF); 110%KHz, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 110%KHz, 1V0.1rms (Cr10uF); 12024Hz, 0.5V0.1rms (Cr10uF) | ||||||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Refer to NO#3 | ||||||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate: C/C10%. Flexural depth: 452. | ||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | ||||||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | ||||||
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | ||||||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on photo. | ||||||
| Embossed Plastic Taping | 0805 (2012) | Tape size: 1.55 0.20 | A: 2.35 0.20, B: 8.00 0.20, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.10, G: 4.00 0.10, H: 1.50 -0/+0.10, J: 1.50 Max | |||||
| 1206 (3216) | Tape size: 1.95 0.20 | A: 3.60 0.20, B: 8.00 0.20, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.10, G: 4.00 0.1, H: 1.50 -0/+0.10, J: 1.85 Max | ||||||
| 1210 (3225) | Tape size: 2.70 0.10 | A: 3.42 0.10, B: 8.00 0.10, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.05, G: 4.00 0.10, H: 1.55 -0/+0.10, J: 3.2 Max | ||||||
| 1808 (4520) | Tape size: 2.20 0.10 | A: 4.95 0.10, B: 12.00 0.10, C: 5.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.05, G: 4.00 0.10, H: 1.50 -0/+0.10, J: 3.0 Max | ||||||
| 1812 (4532) | Tape size: 3.66 0.10 | A: 4.95 0.10, B: 12.00 0.10, C: 5.50 0.05, D: 1.75 0.10, E: 8.00 0.10, F: 2.00 0.05, G: 4.00 0.10, H: 1.55 -0/+0.10, J: 4.0 Max | ||||||
| Paper Tape Reel Packing | 1005 (0402) | Papersize: W1 0.240.02, L1 0.450.02 | B: 8.000.10, C: 3.500.05, D: 1.750.10, E: 2.000.05, F: 2.000.05, G: 4.000.10, H: 1.50 -0/+0.10, J: 0.30 Below | |||||
| 0201 | Papersize: W1 0.370.10, L1 0.670.10 | B: 8.000.10, C: 3.500.05, D: 1.750.10, E: 2.000.05, F: 2.000.05, G: 4.000.10, H: 1.50 -0/+0.10, J: 0.80 Below | ||||||
| 0402 | Papersize: W1 0.650.10, L1 1.150.10 | B: 8.000.10, C: 3.500.05, D: 1.750.10, E: 2.000.05, F: 2.000.05, G: 4.000.10, H: 1.50 -0/+0.10, J: 0.80 Below | ||||||
| Paper Tape Reel Packing (0603, 0805, 1206) | 0603 | Papersize: W1 1.10 0.10, L1 1.90 0.10 | A: 8.00 0.10, B: 3.50 0.05, C: 1.75 0.10, D: 4.00 0.10, E: 2.00 0.10, F: 4.00 0.10, G: 1.50 -0/+0.10, H: 1.10 Max | |||||
| 0805 | Papersize: W1 1.45 0.15, L1 2.30 0.15 | A: 8.0 0.15, B: 3.50 0.05, C: 1.75 0.10, D: 4.00 0.10, E: 2.00 0.10, F: 4.00 0.10, G: 1.50 -0/+0.10, H: 1.10 Max | ||||||
| 1206 | Papersize: W1 1.80 0.20, L1 3.40 0.20 | A: 8.00 0.20, B: 3.50 0.05, C: 1.75 0.10, D: 4.00 0.10, E: 2.00 0.10, F: 4.00 0.10, G: 1.50 -0/+0.10, H: 1.10 Max | ||||||
| Reel Dimensions | 7' REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| 13' REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |
| Top Tape Peeling Strength | Paper Taping | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||
| Packing Quantity (Pcs) | Paper T/R | 0603: 4000, 0805: 4000 | - | |||||
| Plastic T/R | 0805: 3000 (T1.35mm), 3000 (T1.35mm); 1206: 2000 (T1.60mm), 3000 (T1.60mm); 1210: 2000; 1808: 1000 (T1.85mm), 1000 (T1.85mm); 1812: 800; 1812 above: 500 | - | ||||||
| ROHS/REACH Compliance | 7.1 RoHS: meet the standard | - | ||||||
| 7.2 REACH: meet the standard | - | |||||||
| 8 Precautions For Use | MLCC may fail in short or open circuit mode under severe conditions. Follow safety and application notes. | Contact engineering section or factory for handling precautions. | ||||||
| Soldering Profile | Avoid cracks due to sudden temperature change; follow the temperature profile graph. | - | ||||||
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature. | - | ||||||
| Optimum Solder Amount for Reflow Soldering | - | - | ||||||
| Recommended Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | |||
| 1005 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R | ||||
| 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R | ||||
| 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R | ||||
| 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | C1uf R / C1uf R/W / C1uf R / C1uf R/W | R/W / R/W | ||||
| 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | C4.7uf R / C4.7uf R/W / C1uf R / C1uf R/W | R/W / R/W | ||||
| 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | C10uf R / C10uf R/W / C10uf R / C10uf R/W | R/W / R/W | ||||
| 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R | ||||
| Soldering method | RReflow Soldering | WWave Soldering | - | - | - | |||
| The temperature profile for soldering | Preheating temperature difference (soldering temp vs chip surface temp): T150. | - | - | - | - | |||
2509251626_AIDE-CAPACITOR-1206X5R107M100NT_C49326744.pdf
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