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Specifications
Voltage Rating:
63V
Capacitance:
2.2uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R225K630NT
Model Number:
0805X7R225K630NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). |
| Testing Conditions (Normal) | Temperature | 15~35 |
| Humidity | 45~75%RH | |
| Atmosphere | 86~106kPa | |
| Testing Conditions (Relative) | Temperature | 252 |
| Humidity | 60~70%RH | |
| Atmosphere | 86~106kPa | |
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |
| Packing | T Tape/Reel, P Bag packing(PE) | |
| Construction | Ceramic dielectric | N/A |
| Inner electrode | N/A | |
| Outer electrode | N/A | |
| Nickle layer | N/A | |
| Tin layer | N/A | |
| Dimension (mm) | Part number | L W T WB |
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | |
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | |
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 | |
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 | |
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 | |
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | |
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | |
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | |
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | |
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | |
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | |
| Specification and Testing Method | Temperature | -55~+125 |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | |
| Static Capacity | Meet standard specification and tolerance | |
| Dissipation Factor (DF) | Refer to specification for NPO and X7R/X7T/X7P characteristics | |
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area90%, Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic capacity change rate | NPO Characteristic: |C/C|0.5% or 0.5pF. X7R: |C/C|15%. X7T: -33% C/C22%. X7P: |C/C|10%. | |
| Flexural strength | No damage. Electro static capacity change rate |C/C|10%. Flexural depth 452. | |
| Terminal bonding strength | No visual damage. Applied Force: 5N Duration: 101S. | |
| Thermal shock | NPO Characteristic: |C/C|2.5% or 0.25pF. X7R/X7P- characteristic: |C/C|0.5%. X7T characteristic: |C/C|10%. Run 5 cycles. | |
| Temperature moisture exposure | Visual No visual damage. Capacitance change rate: NPO characteristic: |C/C|2% or 1pF. X7R/X7T/X7P characteristic: |C/C|10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | |
| High temperature exposure | Visual No visual damage. Capacitance change rate: NPO: |C/C|2% or 1pF. X7R/X7T/X7P: |C/C|20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | |
| PCB flexural strength | No crack and other defect. | |
| Embossed Plastic Taping Dimensions (mm) | 0805 | Tape size: 1.55 0.20, A: 2.35 0.20, B: 8.00 0.20, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.10, G: 4.00 0.10, H: 1.50 -0/+0.10, J: 1.50 Max |
| 1206 | Tape size: 1.95 0.20, A: 3.60 0.20, B: 8.00 0.20, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.10, G: 4.00 0.1, H: 1.50 -0/+0.10, J: 1.85 Max | |
| 1210 | Tape size: 2.70 0.10, A: 3.42 0.10, B: 8.00 0.10, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.05, G: 4.00 0.10, H: 1.55 -0/+0.10, J: 3.2 Max | |
| 1808 | Tape size: 2.20 0.10, A: 4.95 0.10, B: 12.00 0.10, C: 5.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.05, G: 4.00 0.10, H: 1.50 -0/+0.10, J: 3.0 Max | |
| 1812 | Tape size: 3.66 0.10, A: 4.95 0.10, B: 12.00 0.10, C: 5.50 0.05, D: 1.75 0.10, E: 8.00 0.10, F: 2.00 0.05, G: 4.00 0.10, H: 1.55 -0/+0.10, J: 4.0 Max | |
| Paper Tape Reel Packing Dimensions (mm) | 1005 | W1: 0.240.02, L1: 0.450.02, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.30 Below |
| 0201 | W1: 0.370.10, L1: 0.670.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below | |
| 0402 | W1: 0.650.10, L1: 1.150.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below | |
| 0603 | A: 1.10 0.10, B: 1.90 0.10, C: 8.00 0.10, D: 3.50 0.05, E: 1.75 0.10, F: 4.00 0.10, G: 2.00 0.10, H: 4.00 0.10, J: 1.50 -0/+0.10, T: 1.10 Max | |
| 0805 | A: 1.45 0.15, B: 2.30 0.15, C: 8.0 0.15, D: 3.50 0.05, E: 1.75 0.10, F: 4.00 0.10, G: 2.00 0.10, H: 4.00 0.10, J: 1.50 -0/+0.10, T: 1.10 Max | |
| 1206 | A: 1.80 0.20, B: 3.40 0.20, C: 8.00 0.20, D: 3.50 0.05, E: 1.75 0.10, F: 4.00 0.10, G: 2.00 0.10, H: 4.00 0.10, J: 1.50 -0/+0.10, T: 1.10 Max | |
| Reel Dimensions (mm) | 7REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max |
| 13REEL | 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Top tape peeling strength | Paper Taping | 0.1N < peeling strength < 0.7N |
| Embossed Taping | 0.1N < peeling strength < 0.7N | |
| Packing Quantity | 0603 | Paper T/R (Pcs): 4000 |
| 0805 | Paper T/R (Pcs): 4000; Plastic T/R (Pcs): 3000 | |
| 1206 | Paper T/R (Pcs): N/A; Plastic T/R (Pcs): 3000 (T1.35mm), 2000 (T>1.35mm) | |
| 1210 | Plastic T/R (Pcs): 3000 (T1.60mm), 2000 (T>1.60mm) | |
| 1808 | Plastic T/R (Pcs): 1000 (T1.85mm) | |
| 1812 | Plastic T/R (Pcs): 1000 (T1.85mm), 800 (T>1.85mm) | |
| 1812 above | Plastic T/R (Pcs): 500 |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent failure modes like burn out, flaming, or glowing, adhere to the following precautions and application notes. For handling questions, contact the engineering section or factory.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is carefully handled and appropriate for the task.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| / | C1uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| / | C4.7uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| / | C10uf | R/W | ||
| Y5V | / | C10uf | R | |
| / | C10uf | R/W | ||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method key: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
During preheating, maintain the temperature difference between soldering temperature and surface temperature of chips as T 150.
2509251626_AIDE-CAPACITOR-0805X7R225K630NT_C49326715.pdf
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