Product Overview
The ABRACON ABM8W Series is a low ESR, low CL ceramic SMD crystal designed for modern electronic applications. Measuring 3.2 x 2.5 x 0.8 mm, these crystals are RoHS/RoHS II compliant and optimized for energy-saving wearables and IoT applications. They feature plated components with exceptionally low plating capacitance, as low as 4pF, and optimized ESR for enhanced performance and long-term reliability through seam sealing. Ideal for Bluetooth/BLE, wireless modules, M2M connectivity, ultra-low power MCUs, NFC, and ISM band devices.
Product Attributes
- Brand: ABRACON
- Series: ABM8W
- Certifications: ISO9001-2015 Certified, RoHS/RoHS II Compliant
- MSL Level: N/A
- Origin: USA (Implied by address)
Technical Specifications
| Parameter | Min. | Typ. | Max. | Units | Notes |
|---|---|---|---|---|---|
| Frequency Range | 10.0000 | 54.0000 | MHz | ||
| Operation Mode | Fundamental | ||||
| Operating Temperature Range | -40 | +125 | C | See options | |
| Storage Temperature | -55 | +125 | C | ||
| Frequency Tolerance @ +25C | -10 | +10 | ppm | See options | |
| Frequency Stability over Operating Temperature (ref. to +25C) | -10 | +10 | ppm | See options | |
| Equivalent series resistance (R1) (over -40C to +125C) | < | 100 | 10.0000 11.9999MHz | ||
| Equivalent series resistance (R1) (over -40C to +125C) | < | 60 | 12.0000 15.9999MHz | ||
| Equivalent series resistance (R1) (over -40C to +125C) | < | 40 | 16.0000 19.9999MHz | ||
| Equivalent series resistance (R1) (over -40C to +125C) | < | 25 | 20.0000 29.9999MHz | ||
| Equivalent series resistance (R1) (over -40C to +125C) | < | 20 | 30.0000 39.9999MHz | ||
| Equivalent series resistance (R1) (over -40C to +125C) | < | 18 | 40.0000 54.0000MHz | ||
| Shunt capacitance (C0) | < | 1.2 | pF | ||
| Shunt capacitance (C0) | 2.0 | pF | |||
| Load capacitance (CL) | 4.0 | pF, See options | |||
| Drive Level | 10 | 100 | W | ||
| Aging (1 year) | -2 | +2 | ppm | @ 25C3C | |
| Insulation Resistance | 500 M @ 100Vdc | ||||
| Dimensions | 3.2 x 2.5 x 0.8 mm | ||||
Part Identification Options
Base Part Number: ABM8W
Frequency: Specify in MHz to 4 digit accuracy (e.g., 16.0000MHz). Options available up to 5 & 6 digit accuracy after decimal (Note 1).
Load Capacitance (CL): 8 (8pF), 7 (7pF), 6 (6pF), 4 (4pF)
Packaging: Blank (Bulk), T3 (3kpcs/reel)
Custom ESR: (Specify value in , e.g.: R40)
Frequency Stability: U ( 10 ppm*), G ( 15 ppm**), X ( 20 ppm**), W ( 25 ppm**), Y ( 30 ppm**), H ( 35 ppm**), Z ( 50 ppm), Q ( 100 ppm)
* Only offered @ Operating Temp. Range options: I, E, & B
** Only offered @ Operating Temp. Range options: I, E, B, C, N, & D
Frequency Tolerance: 1 ( 10 ppm), 7 ( 15 ppm), 2 ( 20 ppm), 3 ( 25 ppm), 4 ( 30 ppm), 5 ( 50 ppm)
Operating Temperature: I (0C ~ 50C), E (0C ~ +70C), B (-20C ~ +70C), C (-30C ~ +70C), N (-30C ~ +85C), D (-40C ~ +85C), J (-40C ~ +105C)*, K (-40C ~ +125C)*
* Only offered @ Freq. Stability Options: Z & Q. Contact ABRACON for tighter Frequency Stability. Contact ABRACON for wider Operating Temp. Range.
Reflow Profile [JEDEC J-STD-020]
| Profile Feature | Sn-Pb Eutectic Assembly | Pb-Free Assembly |
|---|---|---|
| Preheat / soak Temperature minimum (Tsmin) | 100C | 150C |
| Temperature maximum (Tsmax) | 150C | 200C |
| Time (Tsmin to Tsmax) (ts) | 60 - 120 sec. | |
| Average ramp-up rate (Tsmax to TP) | 3C/sec. max | |
| Liquidous temperature (TL) | 183C | 217C |
| Time at liquidous (tL) | 60 - 150 sec. | |
| Peak package body temperature (TP)* | see Table 1 | see Table 2 |
| Time (tp)** within 5C of the specified classification temperature (TC) | 20 sec. | 30 sec. |
| Ramp-down rate (Tp to Tsmax) | 6C/sec. max | |
| Time 25C to peak temperature | 6 min. max | 8 min. max |
| Reflow cycles | 2 max | 2 max |
*Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.
**Tolerance for time at peak profile temperature (tp) is defined as supplier minimum and a user maximum.
Process Classification Temperatures (Tc)
Table 1: SnPb Eutectic Process Classification Temperatures (Tc)
| Package Thickness | Volume mm <350 | Volume mm >350 |
|---|---|---|
| <2.5 mm | 235 C | 220 C |
| >2.5 mm | 220 C | 220 C |
Table 2: Pb-Free Process Classification Temperatures (Tc)
| Package Thickness | Volume mm <350 | Volume mm 350-2000 | Volume mm >2000 |
|---|---|---|---|
| <1.6 mm | 260 C | 260 C | 260 C |
| 1.6 mm - 2.5 mm | 260 C | 250 C | 245 C |
| >2.5 mm | 250 C | 245 C | 245 C |
Applications
- Wearables
- Internet of Things (IoT)
- Bluetooth/Bluetooth Low Energy (BLE)
- Wireless modules
- Machine-to-machine (M2M) connectivity
- Ultra-low power MCU
- Near Field Communication (NFC)
- ISM Band
Features
- Optimized for energy saving wearables and IoT applications
- Plated at exceptionally low plating capacitance, as low as 4pF, with optimized ESR
- Seam sealed for long term reliability
Important Notices
ABRACON LLCs products are COTS Commercial-Off-The-Shelf products; suitable for Commercial, Industrial and, where designated, Automotive Applications. Abracons products are not specifically designed for Military, Aviation, Aerospace, Life-dependent Medical applications or any application requiring high reliability where component failure could result in loss of life and/or property. For applications requiring high reliability and/or presenting an extreme operating environment, written consent and authorization from Abracon LLC is required. Please contact Abracon LLC for more information.
2411272236_ABRACON-ABM8W-16-3840MHZ-4-B1U-T3_C5545549.pdf
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